Recent development of temperature compensated SAW devices

Ken Ya Hashimoto, Michio Kadota, Takeshi Nakao, Masanori Ueda, Michio Miura, Hiroyuki Nakamura, Hidekazu Nakanishi, Kenji Suzuki

Research output: Chapter in Book/Report/Conference proceedingConference contribution

32 Citations (Scopus)

Abstract

This paper reviews recent progress of temperature compensated surface acoustic wave (SAW) devices for wireless communications. First, temperature compensation techniques based on the SiO 2 deposition and the wafer bonding are explained, and their implementation into real devices are discussed. Finally, we will show how high performances have been realized by the use of these technologies.

Original languageEnglish
Title of host publication2011 IEEE International Ultrasonics Symposium, IUS 2011
Pages79-86
Number of pages8
DOIs
Publication statusPublished - 2011 Dec 1
Event2011 IEEE International Ultrasonics Symposium, IUS 2011 - Orlando, FL, United States
Duration: 2011 Oct 182011 Oct 21

Publication series

NameIEEE International Ultrasonics Symposium, IUS
ISSN (Print)1948-5719
ISSN (Electronic)1948-5727

Other

Other2011 IEEE International Ultrasonics Symposium, IUS 2011
CountryUnited States
CityOrlando, FL
Period11/10/1811/10/21

ASJC Scopus subject areas

  • Acoustics and Ultrasonics

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