Reaction of Sn to nanocrystalline surface layer of Cu by near surface severe plastic deformation

Y. Minamino, Y. Koizumi, N. Tsuji, Y. Nakamizo, T. Shibayanagi, M. Naka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The near surface ultrafine grains (NSUFG) layer with grain sizes of about 35nm to 200nm from surface to about 10μm was prepared in the OFHC-Cu sheet with coarse grains size of about 7.2μ m (CG-Cu) by Near Surface Sever Plastic Deformation method. The solid reactions of Sn to NSUFG layer and CG-Cu were basically investigated at 379K to 493K for 1x103 to 6x106s. The Cu6Sn5 (η) and Cu3Sn (ε) layers were formed between Cu and Sn. The thickness of the ε layer in NSUFG-Cu/Sn was similar to that in CG-Cu/Sn one, while the thickness of the η layer in NSUFG-Cu/Sn reaction was about two times thicker than that in CG-Cu/Sn one. This enhancement of the η layer growth in NSUFG-Cu/Sn reaction was due to the large supply of Cu atoms to the reaction layer by the grain boundary diffusion in the NSUFG-Cu. The rate-controlling processes of layer growth were boundary diffusion mechanism in reaction layer at lower temperatures in shorter annealing time, and volume diffusion mechanism at higher temperatures in longer annealing times.

Original languageEnglish
Title of host publicationDesigning of Interfacial Structures in Advanced Materials and their Joints
EditorsMasaaki Naka
PublisherTrans Tech Publications Ltd
Pages115-120
Number of pages6
ISBN (Print)9783908451334
DOIs
Publication statusPublished - 2007 Jan 1
EventInternational Workshop on Designing of Interfacial Structures in Advanced Materials and their Joints, DIS 2006 - Osaka, Japan
Duration: 2006 May 182006 May 20

Publication series

NameSolid State Phenomena
Volume127
ISSN (Print)1012-0394
ISSN (Electronic)1662-9779

Other

OtherInternational Workshop on Designing of Interfacial Structures in Advanced Materials and their Joints, DIS 2006
CountryJapan
CityOsaka
Period06/5/1806/5/20

Keywords

  • Diffusion
  • Electroplated tin
  • Intermetallic compounds
  • Layer growth
  • Near surface severe plastic deformation
  • Near surface ultrafine grains
  • OFHC-Cu
  • Reaction

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics
  • Materials Science(all)
  • Condensed Matter Physics

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