Reaction of Sn to nanocrystalline surface layer of Cu by near surface severe plastic deformation

Y. Minamino; Yuichiro Koizumi; N. Tsuji; Y. Nakamizo; T. Shibayanagi; M. Naka

doi:10.4028/3-908451-33-7.115

Reaction of Sn to nanocrystalline surface layer of Cu by near surface severe plastic deformation

Y. Minamino, Yuichiro Koizumi, N. Tsuji, Y. Nakamizo, T. Shibayanagi, M. Naka

Materials Processing and Characterization Division

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

The near surface ultrafine grains (NSUFG) layer with grain sizes of about 35nm to 200nm from surface to about 10 μ m was prepared in the OFHC-Cu sheet with coarse grains size of about 7.2 μ m (CG-Cu) by Near Surface Sever Plastic Deformation method. The solid reactions of Sn to NSUFG layer and CG-Cu were basically investigated at 379K to 493K for 1×10³ to 6×10⁶s. The Cu₆Sn₅ (η) and Cu ₃Sn (ε) layers were formed between Cu and Sn. The thickness of the ε layer in NSUFG-Cu/Sn was similar to that in CG-Cu/Sn one, while the thickness of the η layer in NSUFG-Cu/Sn reaction was about two times thicker than that in CG-Cu/Sn one. This enhancement of the η layer growth in NSUFG-Cu/Sn reaction was due to the large supply of Cu atoms to the reaction layer by the grain boundary diffusion in the NSUFG-Cu. The rate-controlling processes of layer growth were boundary diffusion mechanism in reaction layer at lower temperatures in shorter annealing time, and volume diffusion mechanism at higher temperatures in longer annealing times.

Original language	English
Title of host publication	Designing of Interfacial Structures in Advanced Materials and their Joints - Proceedings of the Int. Workshop on Designing of Interfacial Structures in Advanced Materials and their Joints, DIS'06
Publisher	Trans Tech Publications Ltd
Pages	115-120
Number of pages	6
ISBN (Print)	9783908451334
DOIs	https://doi.org/10.4028/3-908451-33-7.115
Publication status	Published - 2007 Jan 1
Event	International Workshop on Designing of Interfacial Structures in Advanced Materials and their Joints, DIS'06 - Osaka, Japan Duration: 2006 May 18 → 2006 May 20

Publication series

Name	Solid State Phenomena
Volume	127
ISSN (Print)	1012-0394

Other

Other	International Workshop on Designing of Interfacial Structures in Advanced Materials and their Joints, DIS'06
Country/Territory	Japan
City	Osaka
Period	06/5/18 → 06/5/20

Keywords

Diffusion
Electroplated tin
Intermetallic compounds
Layer growth
Near surface severe plastic deformation
Near surface ultrafine grains
OFHC-Cu
Reaction

ASJC Scopus subject areas

Atomic and Molecular Physics, and Optics
Materials Science(all)
Condensed Matter Physics

Access to Document

10.4028/3-908451-33-7.115

Cite this

Minamino, Y., Koizumi, Y., Tsuji, N., Nakamizo, Y., Shibayanagi, T., & Naka, M. (2007). Reaction of Sn to nanocrystalline surface layer of Cu by near surface severe plastic deformation. In Designing of Interfacial Structures in Advanced Materials and their Joints - Proceedings of the Int. Workshop on Designing of Interfacial Structures in Advanced Materials and their Joints, DIS'06 (pp. 115-120). (Solid State Phenomena; Vol. 127). Trans Tech Publications Ltd. https://doi.org/10.4028/3-908451-33-7.115

Reaction of Sn to nanocrystalline surface layer of Cu by near surface severe plastic deformation. / Minamino, Y.; Koizumi, Yuichiro; Tsuji, N. et al.

Designing of Interfacial Structures in Advanced Materials and their Joints - Proceedings of the Int. Workshop on Designing of Interfacial Structures in Advanced Materials and their Joints, DIS'06. Trans Tech Publications Ltd, 2007. p. 115-120 (Solid State Phenomena; Vol. 127).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Minamino, Y, Koizumi, Y, Tsuji, N, Nakamizo, Y, Shibayanagi, T & Naka, M 2007, Reaction of Sn to nanocrystalline surface layer of Cu by near surface severe plastic deformation. in Designing of Interfacial Structures in Advanced Materials and their Joints - Proceedings of the Int. Workshop on Designing of Interfacial Structures in Advanced Materials and their Joints, DIS'06. Solid State Phenomena, vol. 127, Trans Tech Publications Ltd, pp. 115-120, International Workshop on Designing of Interfacial Structures in Advanced Materials and their Joints, DIS'06, Osaka, Japan, 06/5/18. https://doi.org/10.4028/3-908451-33-7.115

Minamino Y, Koizumi Y, Tsuji N, Nakamizo Y, Shibayanagi T, Naka M. Reaction of Sn to nanocrystalline surface layer of Cu by near surface severe plastic deformation. In Designing of Interfacial Structures in Advanced Materials and their Joints - Proceedings of the Int. Workshop on Designing of Interfacial Structures in Advanced Materials and their Joints, DIS'06. Trans Tech Publications Ltd. 2007. p. 115-120. (Solid State Phenomena). doi: 10.4028/3-908451-33-7.115

Minamino, Y. ; Koizumi, Yuichiro ; Tsuji, N. et al. / Reaction of Sn to nanocrystalline surface layer of Cu by near surface severe plastic deformation. Designing of Interfacial Structures in Advanced Materials and their Joints - Proceedings of the Int. Workshop on Designing of Interfacial Structures in Advanced Materials and their Joints, DIS'06. Trans Tech Publications Ltd, 2007. pp. 115-120 (Solid State Phenomena).

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abstract = "The near surface ultrafine grains (NSUFG) layer with grain sizes of about 35nm to 200nm from surface to about 10 μ m was prepared in the OFHC-Cu sheet with coarse grains size of about 7.2 μ m (CG-Cu) by Near Surface Sever Plastic Deformation method. The solid reactions of Sn to NSUFG layer and CG-Cu were basically investigated at 379K to 493K for 1×103 to 6×106s. The Cu6Sn5 (η) and Cu 3Sn (ε) layers were formed between Cu and Sn. The thickness of the ε layer in NSUFG-Cu/Sn was similar to that in CG-Cu/Sn one, while the thickness of the η layer in NSUFG-Cu/Sn reaction was about two times thicker than that in CG-Cu/Sn one. This enhancement of the η layer growth in NSUFG-Cu/Sn reaction was due to the large supply of Cu atoms to the reaction layer by the grain boundary diffusion in the NSUFG-Cu. The rate-controlling processes of layer growth were boundary diffusion mechanism in reaction layer at lower temperatures in shorter annealing time, and volume diffusion mechanism at higher temperatures in longer annealing times.",

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AU - Shibayanagi, T.

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AB - The near surface ultrafine grains (NSUFG) layer with grain sizes of about 35nm to 200nm from surface to about 10 μ m was prepared in the OFHC-Cu sheet with coarse grains size of about 7.2 μ m (CG-Cu) by Near Surface Sever Plastic Deformation method. The solid reactions of Sn to NSUFG layer and CG-Cu were basically investigated at 379K to 493K for 1×103 to 6×106s. The Cu6Sn5 (η) and Cu 3Sn (ε) layers were formed between Cu and Sn. The thickness of the ε layer in NSUFG-Cu/Sn was similar to that in CG-Cu/Sn one, while the thickness of the η layer in NSUFG-Cu/Sn reaction was about two times thicker than that in CG-Cu/Sn one. This enhancement of the η layer growth in NSUFG-Cu/Sn reaction was due to the large supply of Cu atoms to the reaction layer by the grain boundary diffusion in the NSUFG-Cu. The rate-controlling processes of layer growth were boundary diffusion mechanism in reaction layer at lower temperatures in shorter annealing time, and volume diffusion mechanism at higher temperatures in longer annealing times.

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Reaction of Sn to nanocrystalline surface layer of Cu by near surface severe plastic deformation

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