@inproceedings{cf0f61313e58404ebc688c51e3edc61c,
title = "Reaction of Sn to nanocrystalline surface layer of Cu by near surface severe plastic deformation",
abstract = "The near surface ultrafine grains (NSUFG) layer with grain sizes of about 35nm to 200nm from surface to about 10 μ m was prepared in the OFHC-Cu sheet with coarse grains size of about 7.2 μ m (CG-Cu) by Near Surface Sever Plastic Deformation method. The solid reactions of Sn to NSUFG layer and CG-Cu were basically investigated at 379K to 493K for 1×103 to 6×106s. The Cu6Sn5 (η) and Cu 3Sn (ε) layers were formed between Cu and Sn. The thickness of the ε layer in NSUFG-Cu/Sn was similar to that in CG-Cu/Sn one, while the thickness of the η layer in NSUFG-Cu/Sn reaction was about two times thicker than that in CG-Cu/Sn one. This enhancement of the η layer growth in NSUFG-Cu/Sn reaction was due to the large supply of Cu atoms to the reaction layer by the grain boundary diffusion in the NSUFG-Cu. The rate-controlling processes of layer growth were boundary diffusion mechanism in reaction layer at lower temperatures in shorter annealing time, and volume diffusion mechanism at higher temperatures in longer annealing times.",
keywords = "Diffusion, Electroplated tin, Intermetallic compounds, Layer growth, Near surface severe plastic deformation, Near surface ultrafine grains, OFHC-Cu, Reaction",
author = "Y. Minamino and Yuichiro Koizumi and N. Tsuji and Y. Nakamizo and T. Shibayanagi and M. Naka",
year = "2007",
month = jan,
day = "1",
doi = "10.4028/3-908451-33-7.115",
language = "English",
isbn = "9783908451334",
series = "Solid State Phenomena",
publisher = "Trans Tech Publications Ltd",
pages = "115--120",
booktitle = "Designing of Interfacial Structures in Advanced Materials and their Joints - Proceedings of the Int. Workshop on Designing of Interfacial Structures in Advanced Materials and their Joints, DIS'06",
note = "International Workshop on Designing of Interfacial Structures in Advanced Materials and their Joints, DIS'06 ; Conference date: 18-05-2006 Through 20-05-2006",
}