Reaction bonding of microstructured silicon carbide using polymer and silicon thin film

K. Rajanna, S. Tanaka, T. Itoh, M. Esashi

Research output: Contribution to journalConference article

Abstract

We report the successful bonding of microstructured Silicon carbide using the reaction between polymer layer and sputtered silicon thin film. The necessary steps and the process parameters have been optimized. The bonded substrates have been analyzed using optical microscope, SEM/EDX and ESCA. The substrates were also tested for their bond strength. It has been found that optimum combination of silicon film thickness and polymer layer in sandwich configuration is necessary for achieving better bond strength.

Original languageEnglish
Pages (from-to)1527-1530
Number of pages4
JournalMaterials Science Forum
Volume457-460
Issue numberII
DOIs
Publication statusPublished - 2004 Jan 1
EventProceedings of the 10th International Conference on Silicon Carbide and Related Materials, ICSCRM 2003 - Lyon, France
Duration: 2003 Oct 52003 Oct 10

Keywords

  • Bond strength measurement
  • MEMS
  • Microstructured silicon carbide
  • Reaction bonding
  • Reactive ion etching

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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