TY - GEN
T1 - RDL-first Flexible FOWLP Technology with Dielets Embedded in Hydrogel
AU - Takahashi, Noriyuki
AU - Susumago, Yuki
AU - Lee, Sungho
AU - Miwa, Yuki
AU - Kino, Hisashi
AU - Tanaka, Tetsu
AU - Fukushima, Takafumi
N1 - Funding Information:
ACKNOWLEDGEMENT This work was performed in the Micro/Nano-machining research and education Center (MNC) and Jun-ichi Nishizawa Research Center at Tohoku University. This work was fully supported by JSPS KAKENHI (Grants-in-Aid for Scientific Research) Grant Number 18K18841 of Challenging Research (Exploratory). This work was also partially supported by JSPS KAKENHI (Grants-in-Aid for Scientific Research) Grant Number 19KK0101 of the Promotion of Joint International Research (Fostering Joint International Research (B)).
Publisher Copyright:
© 2020 IEEE.
PY - 2020/6
Y1 - 2020/6
N2 - A new flexible hybrid electronics (FHE) methodology using advanced RDL-first fan-out wafer-level packaging (FOWLP) technologies with dielets and hydrogel substrates is proposed. Hydrogels mainly consisting of water have excellent biocompatibility, high adaptability, and substance permeability, and they are expected for biomedical applications. In this work, we integrate Si LSI and mini-LED dielets in a hydrogel substrate on which fine-feature Au interconnections are formed in wafer-level processing. We characterize their electrical properties of the embedded dielets for biomedical applications.
AB - A new flexible hybrid electronics (FHE) methodology using advanced RDL-first fan-out wafer-level packaging (FOWLP) technologies with dielets and hydrogel substrates is proposed. Hydrogels mainly consisting of water have excellent biocompatibility, high adaptability, and substance permeability, and they are expected for biomedical applications. In this work, we integrate Si LSI and mini-LED dielets in a hydrogel substrate on which fine-feature Au interconnections are formed in wafer-level processing. We characterize their electrical properties of the embedded dielets for biomedical applications.
KW - Flexible Hybrid Electronics (FHE)
KW - Hydrogel
KW - Mini-LED
KW - RDL-first FOWLP
KW - and Bio patch
UR - http://www.scopus.com/inward/record.url?scp=85090287275&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85090287275&partnerID=8YFLogxK
U2 - 10.1109/ECTC32862.2020.00132
DO - 10.1109/ECTC32862.2020.00132
M3 - Conference contribution
AN - SCOPUS:85090287275
T3 - Proceedings - Electronic Components and Technology Conference
SP - 811
EP - 816
BT - Proceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 70th IEEE Electronic Components and Technology Conference, ECTC 2020
Y2 - 3 June 2020 through 30 June 2020
ER -