RDL-first Flexible FOWLP Technology with Dielets Embedded in Hydrogel

Noriyuki Takahashi; Yuki Susumago; Sungho Lee; Yuki Miwa; Hisashi Kino; Tetsu Tanaka; Takafumi Fukushima

doi:10.1109/ECTC32862.2020.00132

RDL-first Flexible FOWLP Technology with Dielets Embedded in Hydrogel

Noriyuki Takahashi, Yuki Susumago, Sungho Lee, Yuki Miwa, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

A new flexible hybrid electronics (FHE) methodology using advanced RDL-first fan-out wafer-level packaging (FOWLP) technologies with dielets and hydrogel substrates is proposed. Hydrogels mainly consisting of water have excellent biocompatibility, high adaptability, and substance permeability, and they are expected for biomedical applications. In this work, we integrate Si LSI and mini-LED dielets in a hydrogel substrate on which fine-feature Au interconnections are formed in wafer-level processing. We characterize their electrical properties of the embedded dielets for biomedical applications.

Original language	English
Title of host publication	Proceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	811-816
Number of pages	6
ISBN (Electronic)	9781728161808
DOIs	https://doi.org/10.1109/ECTC32862.2020.00132
Publication status	Published - 2020 Jun
Event	70th IEEE Electronic Components and Technology Conference, ECTC 2020 - Orlando, United States Duration: 2020 Jun 3 → 2020 Jun 30

Publication series

Name	Proceedings - Electronic Components and Technology Conference
Volume	2020-June
ISSN (Print)	0569-5503

Conference

Conference	70th IEEE Electronic Components and Technology Conference, ECTC 2020
Country	United States
City	Orlando
Period	20/6/3 → 20/6/30

Keywords

Flexible Hybrid Electronics (FHE)
Hydrogel
Mini-LED
RDL-first FOWLP
and Bio patch

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Access to Document

10.1109/ECTC32862.2020.00132

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Cite this

Takahashi, N., Susumago, Y., Lee, S., Miwa, Y., Kino, H., Tanaka, T., & Fukushima, T. (2020). RDL-first Flexible FOWLP Technology with Dielets Embedded in Hydrogel. In Proceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020 (pp. 811-816). [9159422] (Proceedings - Electronic Components and Technology Conference; Vol. 2020-June). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC32862.2020.00132

RDL-first Flexible FOWLP Technology with Dielets Embedded in Hydrogel. / Takahashi, Noriyuki; Susumago, Yuki; Lee, Sungho; Miwa, Yuki; Kino, Hisashi ; Tanaka, Tetsu ; Fukushima, Takafumi.

Proceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Institute of Electrical and Electronics Engineers Inc., 2020. p. 811-816 9159422 (Proceedings - Electronic Components and Technology Conference; Vol. 2020-June).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Takahashi, N, Susumago, Y, Lee, S, Miwa, Y, Kino, H , Tanaka, T & Fukushima, T 2020, RDL-first Flexible FOWLP Technology with Dielets Embedded in Hydrogel. in Proceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020., 9159422, Proceedings - Electronic Components and Technology Conference, vol. 2020-June, Institute of Electrical and Electronics Engineers Inc., pp. 811-816, 70th IEEE Electronic Components and Technology Conference, ECTC 2020, Orlando, United States, 20/6/3. https://doi.org/10.1109/ECTC32862.2020.00132

Takahashi N, Susumago Y, Lee S, Miwa Y, Kino H , Tanaka T et al. RDL-first Flexible FOWLP Technology with Dielets Embedded in Hydrogel. In Proceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Institute of Electrical and Electronics Engineers Inc. 2020. p. 811-816. 9159422. (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC32862.2020.00132

Takahashi, Noriyuki ; Susumago, Yuki ; Lee, Sungho ; Miwa, Yuki ; Kino, Hisashi ; Tanaka, Tetsu ; Fukushima, Takafumi. / RDL-first Flexible FOWLP Technology with Dielets Embedded in Hydrogel. Proceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Institute of Electrical and Electronics Engineers Inc., 2020. pp. 811-816 (Proceedings - Electronic Components and Technology Conference).

@inproceedings{33b23cd1de6a429c939be6e7516e10c7,

title = "RDL-first Flexible FOWLP Technology with Dielets Embedded in Hydrogel",

abstract = "A new flexible hybrid electronics (FHE) methodology using advanced RDL-first fan-out wafer-level packaging (FOWLP) technologies with dielets and hydrogel substrates is proposed. Hydrogels mainly consisting of water have excellent biocompatibility, high adaptability, and substance permeability, and they are expected for biomedical applications. In this work, we integrate Si LSI and mini-LED dielets in a hydrogel substrate on which fine-feature Au interconnections are formed in wafer-level processing. We characterize their electrical properties of the embedded dielets for biomedical applications.",

keywords = "Flexible Hybrid Electronics (FHE), Hydrogel, Mini-LED, RDL-first FOWLP, and Bio patch",

author = "Noriyuki Takahashi and Yuki Susumago and Sungho Lee and Yuki Miwa and Hisashi Kino and Tetsu Tanaka and Takafumi Fukushima",

note = "Funding Information: ACKNOWLEDGEMENT This work was performed in the Micro/Nano-machining research and education Center (MNC) and Jun-ichi Nishizawa Research Center at Tohoku University. This work was fully supported by JSPS KAKENHI (Grants-in-Aid for Scientific Research) Grant Number 18K18841 of Challenging Research (Exploratory). This work was also partially supported by JSPS KAKENHI (Grants-in-Aid for Scientific Research) Grant Number 19KK0101 of the Promotion of Joint International Research (Fostering Joint International Research (B)).; 70th IEEE Electronic Components and Technology Conference, ECTC 2020 ; Conference date: 03-06-2020 Through 30-06-2020",

year = "2020",

month = jun,

doi = "10.1109/ECTC32862.2020.00132",

language = "English",

series = "Proceedings - Electronic Components and Technology Conference",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "811--816",

booktitle = "Proceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020",

}

TY - GEN

T1 - RDL-first Flexible FOWLP Technology with Dielets Embedded in Hydrogel

AU - Takahashi, Noriyuki

AU - Susumago, Yuki

AU - Lee, Sungho

AU - Miwa, Yuki

AU - Kino, Hisashi

AU - Tanaka, Tetsu

AU - Fukushima, Takafumi

N1 - Funding Information: ACKNOWLEDGEMENT This work was performed in the Micro/Nano-machining research and education Center (MNC) and Jun-ichi Nishizawa Research Center at Tohoku University. This work was fully supported by JSPS KAKENHI (Grants-in-Aid for Scientific Research) Grant Number 18K18841 of Challenging Research (Exploratory). This work was also partially supported by JSPS KAKENHI (Grants-in-Aid for Scientific Research) Grant Number 19KK0101 of the Promotion of Joint International Research (Fostering Joint International Research (B)).

PY - 2020/6

Y1 - 2020/6

N2 - A new flexible hybrid electronics (FHE) methodology using advanced RDL-first fan-out wafer-level packaging (FOWLP) technologies with dielets and hydrogel substrates is proposed. Hydrogels mainly consisting of water have excellent biocompatibility, high adaptability, and substance permeability, and they are expected for biomedical applications. In this work, we integrate Si LSI and mini-LED dielets in a hydrogel substrate on which fine-feature Au interconnections are formed in wafer-level processing. We characterize their electrical properties of the embedded dielets for biomedical applications.

AB - A new flexible hybrid electronics (FHE) methodology using advanced RDL-first fan-out wafer-level packaging (FOWLP) technologies with dielets and hydrogel substrates is proposed. Hydrogels mainly consisting of water have excellent biocompatibility, high adaptability, and substance permeability, and they are expected for biomedical applications. In this work, we integrate Si LSI and mini-LED dielets in a hydrogel substrate on which fine-feature Au interconnections are formed in wafer-level processing. We characterize their electrical properties of the embedded dielets for biomedical applications.

KW - Flexible Hybrid Electronics (FHE)

KW - Hydrogel

KW - Mini-LED

KW - RDL-first FOWLP

KW - and Bio patch

UR - http://www.scopus.com/inward/record.url?scp=85090287275&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85090287275&partnerID=8YFLogxK

U2 - 10.1109/ECTC32862.2020.00132

DO - 10.1109/ECTC32862.2020.00132

M3 - Conference contribution

AN - SCOPUS:85090287275

T3 - Proceedings - Electronic Components and Technology Conference

SP - 811

EP - 816

BT - Proceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 70th IEEE Electronic Components and Technology Conference, ECTC 2020

Y2 - 3 June 2020 through 30 June 2020

ER -