RDL-first Flexible FOWLP Technology with Dielets Embedded in Hydrogel

Noriyuki Takahashi, Yuki Susumago, Sungho Lee, Yuki Miwa, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A new flexible hybrid electronics (FHE) methodology using advanced RDL-first fan-out wafer-level packaging (FOWLP) technologies with dielets and hydrogel substrates is proposed. Hydrogels mainly consisting of water have excellent biocompatibility, high adaptability, and substance permeability, and they are expected for biomedical applications. In this work, we integrate Si LSI and mini-LED dielets in a hydrogel substrate on which fine-feature Au interconnections are formed in wafer-level processing. We characterize their electrical properties of the embedded dielets for biomedical applications.

Original languageEnglish
Title of host publicationProceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages811-816
Number of pages6
ISBN (Electronic)9781728161808
DOIs
Publication statusPublished - 2020 Jun
Event70th IEEE Electronic Components and Technology Conference, ECTC 2020 - Orlando, United States
Duration: 2020 Jun 32020 Jun 30

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2020-June
ISSN (Print)0569-5503

Conference

Conference70th IEEE Electronic Components and Technology Conference, ECTC 2020
CountryUnited States
CityOrlando
Period20/6/320/6/30

Keywords

  • Flexible Hybrid Electronics (FHE)
  • Hydrogel
  • Mini-LED
  • RDL-first FOWLP
  • and Bio patch

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'RDL-first Flexible FOWLP Technology with Dielets Embedded in Hydrogel'. Together they form a unique fingerprint.

Cite this