Rapid and mass growth of stress-induced nanowhiskers on the surfaces of evaporated polycrystalline Cu films

Masumi Saka, Fumihiko Yamaya, Hironori Tohmyoh

Research output: Contribution to journalArticlepeer-review

56 Citations (Scopus)

Abstract

The rapid and mass growth of Cu nanowhiskers on polycrystalline films has been realized. The diameter and length of the nanowhiskers are governed by temperature, film thickness, grain size and time. Here we report a mechanism for the growth of the nanowhiskers. Cu atoms diffuse due to local stress gradients in the grains which originate in the material and geometrical singularities caused by anisotropy. Weak spots in the oxide layers on the films act as initiation sites for the nanowhiskers.

Original languageEnglish
Pages (from-to)1031-1034
Number of pages4
JournalScripta Materialia
Volume56
Issue number12
DOIs
Publication statusPublished - 2007 Jun

Keywords

  • Copper
  • Nanostructure
  • Stress-induced migration
  • Thin films
  • Whiskers

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys

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