Radiative cooling using plasmon resonant nanostrips

Teppei Onuki, Hiroki Kuwano

Research output: Contribution to journalArticlepeer-review

Abstract

Optical (far infrared) and thermal properties of a copper nanostrip array on silicon substrate were investigated. It acted as a coupler between the radiation and heat on the surface as nonradiative components (phonon or plasmon polariton at the surface), aiming to enhance outward heat flux from the surface as a cooling device via radiation heat transfer. The emission spectrum of the heat radiation was controlled by the nanostrip array that was designed as the local plasmon and phonon resonant conditions. In the experiment, it generated the temperature gradient of 1.3 K across the substrate thickness (0.5 mm) when the substrate was contacted on the heater (42°C) in the atmosphere at 26°C.

Original languageEnglish
Pages (from-to)1917-1919
Number of pages3
JournalNihon Kikai Gakkai Ronbunshu, C Hen/Transactions of the Japan Society of Mechanical Engineers, Part C
Volume76
Issue number768
DOIs
Publication statusPublished - 2010 Aug

Keywords

  • Plasmon resonant nanostrips
  • Radiation cooling

ASJC Scopus subject areas

  • Mechanics of Materials
  • Mechanical Engineering
  • Industrial and Manufacturing Engineering

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