TY - GEN
T1 - Quarter Video Graphics Array Full-Digital Image Sensing with Wide Dynamic Range and Linear Output Using Pixel-Wise 3D Integration
AU - Goto, Masahide
AU - Honda, Yuki
AU - Watabe, Toshihisa
AU - Hagiwara, Kei
AU - Nanba, Masakazu
AU - Iguchi, Yoshinori
AU - Saraya, Takuya
AU - Kobayashi, Masaharu
AU - Higurashi, Eiji
AU - Toshiyoshi, Hiroshi
AU - Hiramoto, Toshiro
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/4/26
Y1 - 2018/4/26
N2 - We have developed a quarter video graphics array (QVGA) chip for full-digital image sensing by using three-dimensional (3D) integration technology. In-pixel pulse-frequency modulation (PFM) analog-to-digital converter (ADC) gives full-digital imaging pixel, which is known to overcome signal saturation due to the full well capacity of a photodiode (PD). We have also newly designed a PFM-ADC for pixels with a pinned PD and a floating diffusion to achieve high sensitivity and low noise. PDs and ADCs were stacked into two layers by pixel-wise 3D integration with gold electrodes of 5 μm in diameter, thereby enabling QVGA resolution for a 20-mm square chip in 0.18-μm and 0.2-μm process nodes. The developed sensor chip exhibited an excellent linearity and wide dynamic range of more than 96 dB. We also obtained video images with a high bit depth of 16 bit, demonstrating the superior image sensing that can capture the real world at high fidelity.
AB - We have developed a quarter video graphics array (QVGA) chip for full-digital image sensing by using three-dimensional (3D) integration technology. In-pixel pulse-frequency modulation (PFM) analog-to-digital converter (ADC) gives full-digital imaging pixel, which is known to overcome signal saturation due to the full well capacity of a photodiode (PD). We have also newly designed a PFM-ADC for pixels with a pinned PD and a floating diffusion to achieve high sensitivity and low noise. PDs and ADCs were stacked into two layers by pixel-wise 3D integration with gold electrodes of 5 μm in diameter, thereby enabling QVGA resolution for a 20-mm square chip in 0.18-μm and 0.2-μm process nodes. The developed sensor chip exhibited an excellent linearity and wide dynamic range of more than 96 dB. We also obtained video images with a high bit depth of 16 bit, demonstrating the superior image sensing that can capture the real world at high fidelity.
KW - analog-to-digital converter
KW - dynamic range
KW - image sensor
KW - pulse
KW - three-dimensional integration
UR - http://www.scopus.com/inward/record.url?scp=85057134985&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85057134985&partnerID=8YFLogxK
U2 - 10.1109/ISCAS.2018.8351002
DO - 10.1109/ISCAS.2018.8351002
M3 - Conference contribution
AN - SCOPUS:85057134985
T3 - Proceedings - IEEE International Symposium on Circuits and Systems
BT - 2018 IEEE International Symposium on Circuits and Systems, ISCAS 2018 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2018 IEEE International Symposium on Circuits and Systems, ISCAS 2018
Y2 - 27 May 2018 through 30 May 2018
ER -