TY - JOUR
T1 - Quantitative derivation and evaluation of wire length distribution in three-dimensional integrated circuits using simulated quenching
AU - Deguchi, Jun
AU - Sugimura, Takeaki
AU - Nakatani, Yoshihiro
AU - Fukushima, Takafumi
AU - Koyanagi, Mitsumasa
PY - 2006/4/25
Y1 - 2006/4/25
N2 - Three-dimensional (3D) integration is the most promising technology to improve IC performance by stacking some active device layers and connecting them using vertical interconnections. In this paper, in order to quantitatively evaluate the benefits of 3D IC, wire length distributions in 3D ICs are derived by adapting the simulated quenching algorithm for 3D placement and routing of specific benchmark circuits. By evaluating the wire length distribution, we can confirm that the total wire length is reduced by 26.0 and 41.3% with three and five active layers, respectively. Similarly, 38.1 and 52.0% reduction in the longest wire length with three and five active layers can be achieved.
AB - Three-dimensional (3D) integration is the most promising technology to improve IC performance by stacking some active device layers and connecting them using vertical interconnections. In this paper, in order to quantitatively evaluate the benefits of 3D IC, wire length distributions in 3D ICs are derived by adapting the simulated quenching algorithm for 3D placement and routing of specific benchmark circuits. By evaluating the wire length distribution, we can confirm that the total wire length is reduced by 26.0 and 41.3% with three and five active layers, respectively. Similarly, 38.1 and 52.0% reduction in the longest wire length with three and five active layers can be achieved.
KW - Simulated quenching
KW - Three-dimensional integration technology
KW - Wire length distribution
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U2 - 10.1143/JJAP.45.3260
DO - 10.1143/JJAP.45.3260
M3 - Article
AN - SCOPUS:33646898175
VL - 45
SP - 3260
EP - 3265
JO - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
JF - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
SN - 0021-4922
IS - 4 B
ER -