TY - GEN
T1 - Quality control of grain boundaries in copper thin films used for 3D interconnections
AU - Nakanishi, Takahiro
AU - Suzuki, Ken
AU - Miura, Hideo
PY - 2014
Y1 - 2014
N2 - In this study, the quality of grain boundaries was evaluated by measuring their strength. In order to evaluate the strength of grain boundaries quantitatively, a micro-tensile test method that can measure the strength of a grain boundary has been developed. A focused ion beam was used for making a fine columnar sample which consisted of two grains in series. The sample was jointed to a small both ends fixed beam made of single-crystalline silicon. A tensile load was applied and the deformation of the sample and the beam was monitored by a scanning electron microscope to measure the load-displacement relationship of the sample. The relationship between the factors of controlling strength and the mechanical properties of the copper thin films was clarified quantitatively by using the micro-tensile test.
AB - In this study, the quality of grain boundaries was evaluated by measuring their strength. In order to evaluate the strength of grain boundaries quantitatively, a micro-tensile test method that can measure the strength of a grain boundary has been developed. A focused ion beam was used for making a fine columnar sample which consisted of two grains in series. The sample was jointed to a small both ends fixed beam made of single-crystalline silicon. A tensile load was applied and the deformation of the sample and the beam was monitored by a scanning electron microscope to measure the load-displacement relationship of the sample. The relationship between the factors of controlling strength and the mechanical properties of the copper thin films was clarified quantitatively by using the micro-tensile test.
UR - http://www.scopus.com/inward/record.url?scp=84925851231&partnerID=8YFLogxK
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U2 - 10.1109/IMPACT.2014.7048348
DO - 10.1109/IMPACT.2014.7048348
M3 - Conference contribution
AN - SCOPUS:84925851231
T3 - 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings
SP - 88
EP - 91
BT - 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2014
Y2 - 22 October 2014 through 24 October 2014
ER -