Abstract
Pb-based solders that contain a great amount of toxic Pb are still used as the high-melting-temperature-type solders to join power semiconductor chips to lead frames. For replacing the Pb-based solder, joining technique using the evaporated Ag/Cu/Sn films were developed. In this study, properties of intermetallic compound (IMC) joint made from the evaporated Ag/Cu/Sn films were investigated. The IMC joint consisting of Cu6Sn5, (Ag, Cu)3Sn and Cu3Sn layers was formed under heat treatment at 573 K for 30s. The IMC joint showed sufficient strength at 543 K to hold Si chip on Cu substrate. The high-temperature strength kept even after aging at 423 K for 3.6 Ms, although some voids were formed in the microstructure of IMC joint aged. The results of nanoindentation test indicate that excessive growth of Cu 3Sn would be undesirable for joint reliability.
| Original language | English |
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| Title of host publication | Materials Research Society Symposium Proceedings - Materials and Devices for Smart Systems III |
| Pages | 335-340 |
| Number of pages | 6 |
| Volume | 1129 |
| Publication status | Published - 2009 Nov 20 |
| Externally published | Yes |
| Event | Materials and Devices for Smart Systems III - 2008 MRS Fall Meeting - Boston, MA, United States Duration: 2008 Dec 1 → 2008 Dec 4 |
Other
| Other | Materials and Devices for Smart Systems III - 2008 MRS Fall Meeting |
|---|---|
| Country | United States |
| City | Boston, MA |
| Period | 08/12/1 → 08/12/4 |
ASJC Scopus subject areas
- Materials Science(all)
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering