Properties of Cu/Au thin films under temperature gradient: a molecular dynamics study

Qi Bin Li, Qi Zhong Tang, Chao Liu, Tie Feng Peng, Xiao Min Zhang, Xiang He Peng, Cheng Huang, Tao Fu, Yin Bo Zhao, Chao Feng

Research output: Contribution to journalArticlepeer-review

Abstract

The thin films with modulation period of 1.8 nm Cu/3.6 nm Au are obtained via deposit method and ideal created based on lattice constant to examine their characteristics under temperature gradient based on molecular dynamics simulations. The coherent lattice interface is found both at deposit and ideal thin films after annealing. Also, the vacancies is found clearly in the deposit thin films. The defect thin films would weak the energy transportation in the coatings. The vacancies and lattice mismatch could enlarge the mobility of atoms and result in the failure of coating under the thermal stress. The power spectrum of atoms' movement showed no apparent rule for phonon transportation in thin films.

Original languageEnglish
Pages (from-to)466-470
Number of pages5
JournalKung Cheng Je Wu Li Hsueh Pao/Journal of Engineering Thermophysics
Volume37
Issue number3
Publication statusPublished - 2016 Mar 1
Externally publishedYes

Keywords

  • Mean square displacement
  • Molecular dynamics simulation
  • Temperature gradient
  • Thin films

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanical Engineering

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