Production of silver coated copper powders by electroless plating method

H. T. Hai, J. G. Ahn, D. J. Kim, J. R. Lee, Y. N. Jang, H. S. Chung, C. O. Kim

Research output: Contribution to journalConference articlepeer-review


Copper powders with very dense, uniform silver coating layer were prepared by electroless plating method in aqueous system at room temperature. Silver-copper composite powders were obtained by strictly controlling the activation and complexing process variables such as NH4OH/(NH 4)2SO4 molar ratio, tartrate concentration, and feeding rate of silver ion solution. The mechanism of composite powders formation and their characteristics were discussed. It is noted that completely cleansing the oxide layers and protecting the copper particles surface from hydrolysis are key factors to obtain high quality Ag-Cu composite powders.

Original languageEnglish
Pages (from-to)570-574
Number of pages5
JournalAdvanced Materials Research
Publication statusPublished - 2007
Externally publishedYes
Event5th International Conference on Processing and Manufacturing of Advanced Materials - THERMEC 2006 - Vancouver, BC, Canada
Duration: 2006 Jul 42006 Jul 8


  • Coating
  • Composite powder
  • Electroless plating

ASJC Scopus subject areas

  • Engineering(all)


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