Processing of PZT microstructures

Shinan Wang, Jing Feng Li, Xinghua Li, Masayoshi Esashi

Research output: Contribution to journalArticlepeer-review

7 Citations (Scopus)

Abstract

Lead zirconate titanate (PZT) ceramic microstructures have been obtained by two reciprocal approaches, both of which are batch-fabrication-oriented. One approach starts from PZT powders using a lost Si mold technique, where a Si mold is prepared by deep reactive ion etching (RIE) and sintering of PZT after slurry casting is performed by glass-encapsulated hot isostatic pressing (HIP). The Si mold is finally etched away selectively by XeF2. The resulting PZT structures are of high density and accurately reflect the complementary shapes of the Si molds. The highest aspect ratio is over 15. Fine PZT rod arrays for ultrasonic microtransducers and parallel plates for stacked piezoelectric microactuators have been achieved. The finest rods are 7 μm square in cross section, 90 μm in height and 12 μm in period; the 25-μm-pitch PZT plates are 18 μm thick and 130 μm high. The other approach is to fabricate bulk PZT substrates into microstructures by deep RIE using SF6 gas with electroplated Ni films as protective masks. The etch depth is 70 μm and the etch rate is 0.3 μm/min.

Original languageEnglish
Pages (from-to)375-384
Number of pages10
JournalSensors and Materials
Volume10
Issue number6
Publication statusPublished - 1998 Dec 1

Keywords

  • HIP
  • High aspect ratio
  • PZT deep RIE
  • PZT microstructures
  • Si mold

ASJC Scopus subject areas

  • Instrumentation
  • Materials Science(all)

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