Process Integration for FlexTrate TM

Tak Fukushima, Yuki Susumago, Hisashi Kino, Tetsu Tanaka, Arsalan Alam, Amir Hanna, Subramanian S. Iyer

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

We fabricate FlexTrate TM that is highly integrated bendable and/or rollable electronic systems in which various Si and/or III-V chips are embedded in elastomers and interconnected at the wafer level. This paper describes the process integration of the FlexTrate TM using massively parallel capillary self-assembly and a new single stress buffer layer technologies to form fine-pitch interconnection between the embedded neighboring chips and characterize the electrical/mechanical properties.

Original languageEnglish
Title of host publication2018 International Flexible Electronics Technology Conference, IFETC 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781538633571
DOIs
Publication statusPublished - 2018 Dec 19
Event2018 International Flexible Electronics Technology Conference, IFETC 2018 - Ottawa, Canada
Duration: 2018 Aug 72018 Aug 9

Publication series

Name2018 International Flexible Electronics Technology Conference, IFETC 2018

Other

Other2018 International Flexible Electronics Technology Conference, IFETC 2018
CountryCanada
CityOttawa
Period18/8/718/8/9

Keywords

  • FOWLP
  • Flexible hybrid electronics
  • Self-assembly

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Instrumentation

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