Preliminary study of atomic diffusion bonding in air using Ag films

Y. Watabe, F. Goto, M. Uomoto, T. Shimatsu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This study assessed atomic diffusion bonding (ADB) of wafers at room temperature in air using Ag films. By improving structural qualities of Ag films and underlayered Ti films, we achieved bonding in air. Remarkable crystal lattice rearrangement occurred at the Ag-Ag bonded interface.

Original languageEnglish
Title of host publication2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages39
Number of pages1
ISBN (Electronic)9781665405676
DOIs
Publication statusPublished - 2021 Oct 5
Event7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021 - Virtual, Online, Japan
Duration: 2021 Oct 52021 Oct 11

Publication series

Name2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021

Conference

Conference7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021
Country/TerritoryJapan
CityVirtual, Online
Period21/10/521/10/11

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Electronic, Optical and Magnetic Materials

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