TY - GEN
T1 - Preliminary study of atomic diffusion bonding in air using Ag films
AU - Watabe, Y.
AU - Goto, F.
AU - Uomoto, M.
AU - Shimatsu, T.
N1 - Funding Information:
This work was supported by the Council for Science, Technology and Innovation (CSTI), Cross-ministerial Strategic Innovation Promotion Program (SIP), "Energy systems toward a decarbonized society" (Funding agency: JST).
Publisher Copyright:
© 2021 IEEE
PY - 2021/10/5
Y1 - 2021/10/5
N2 - This study assessed atomic diffusion bonding (ADB) of wafers at room temperature in air using Ag films. By improving structural qualities of Ag films and underlayered Ti films, we achieved bonding in air. Remarkable crystal lattice rearrangement occurred at the Ag-Ag bonded interface.
AB - This study assessed atomic diffusion bonding (ADB) of wafers at room temperature in air using Ag films. By improving structural qualities of Ag films and underlayered Ti films, we achieved bonding in air. Remarkable crystal lattice rearrangement occurred at the Ag-Ag bonded interface.
UR - http://www.scopus.com/inward/record.url?scp=85120438946&partnerID=8YFLogxK
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U2 - 10.1109/LTB-3D53950.2021.9598421
DO - 10.1109/LTB-3D53950.2021.9598421
M3 - Conference contribution
AN - SCOPUS:85120438946
T3 - 2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021
SP - 39
BT - 2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021
Y2 - 5 October 2021 through 11 October 2021
ER -