The atomic flux divergence due to electromigration has been formulated considering two-dimensional distributions of current density and temperature and the line structures of both polycrystalline line and bamboo line. And the divergence, AFDgen, has been identified as a governing parameter of electromigration damage by experimental verification. In this study, a prediction method of the lifetime and failure site in bamboo line is proposed based on the numerical simulation of electromigration failure process in bamboo line by using AFDgen. The usefulness of this prediction method, which has the advantage to universally predict the line failure by using only the film characteristic constants, is discussed in the light of comparison of the prediction of both lifetime and failure location in the bamboo line with experiment.
|Number of pages||6|
|Journal||American Society of Mechanical Engineers, EEP|
|Publication status||Published - 1999 Dec 1|
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Mechanical Engineering