Precise Micro-Nanomachining of Silicon

Masayoshi Esashi, Risaku Toda, Kazuyuki Minami, Takahito Ono

Research output: Contribution to journalArticlepeer-review

2 Citations (Scopus)

Abstract

Advanced micro sensors for ultrasonic imaging, pressure, acceleration, angular rate and atomic force have been realized based on silicon bulk-micromachining. Novel techniques as deep Reactive Ion Etching (RIE), XeF2 silicon etching have been developed for precise micromachining and applied for the sensors. The deep RIE of silicon has been applied for electrostatic microactuators. Parallel electrodes in a packaged glasssilicon structure enable electrostatic force balancing servo sensors, resonant sensors and electrostatically levitating micromotors. Nano-machining based on the Scanning Tunneling Microscopy (STM) technology have been also developed to fabricate extremely small structures.

Original languageEnglish
Pages (from-to)489-497
Number of pages9
JournalIEEJ Transactions on Sensors and Micromachines
Volume119
Issue number10
DOIs
Publication statusPublished - 1999 Jan 1

Keywords

  • Bulk-Micromachining
  • Microsensors
  • Nanomachining
  • Precise-Micromachining

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering

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