Abstract
Advanced silicon micro sensors for pressure, acceleration, angular rate, infrared radiation and atomic force have been developed based on bulk silicon micromachining. Distortion-free, precise or very small micro-nanostructures enables extremely sensitive and quick response sensors. Packaged, capacitive and integrated sensors were fabricated. Electrostatic force balancing sensors and resonant sensors performed wide dynamic range and high sensitivity respectively. Novel micromachining techniques developed and applied for the sensors were vacuum packaging, distortion-free anodic bonding, deep RE, XeF2 silicon etching, thickness monitoring during silicon etching, silicon nano-wire growth by electric field evaporation using UHV STM etc.
| Original language | English |
|---|---|
| Pages (from-to) | 44-55 |
| Number of pages | 12 |
| Journal | Proceedings of SPIE - The International Society for Optical Engineering |
| Volume | 3223 |
| DOIs | |
| Publication status | Published - 1997 Dec 1 |
| Event | Micromachining and Microfabrication Process Technology III - Austin, TX, United States Duration: 1997 Sep 29 → 1997 Sep 29 |
Keywords
- AFM probes
- Accelerometers
- Angular rate sensors
- Capacitive sensors
- Micromachining
- Nanomachining
- Pressure sensors
- Resonant sensors
- Sensor packaging
- Vacuum sensors
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Computer Science Applications
- Applied Mathematics
- Electrical and Electronic Engineering