Practical integration method of active devices on SOI photonic integrated circuits

Tomohiro Kita, Masahiro Abe, Yasuo Ohtera, Hirohito Yamada

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

We propose a method of mounting LD chips on SOI substrate and discuss about the optical coupling loss between LDs and Si photonic-wire waveguides. In our scheme, light output from an LD is coupled to the optical waveguides through spot-size-converters (SSC). The simulations show that a minimum optical coupling loss of 1.6 dB and an offset tolerance of ±0.7 μm for the LD chip positioning can be achieved. We measured the optical coupling loss, confirming the validity of the simulations.

Original languageEnglish
Title of host publication2010 7th IEEE International Conference on Group IV Photonics, GFP 2010
Pages275-277
Number of pages3
DOIs
Publication statusPublished - 2010 Dec 1
Event2010 7th IEEE International Conference on Group IV Photonics, GFP 2010 - Beijing, China
Duration: 2010 Sep 12010 Sep 3

Publication series

NameIEEE International Conference on Group IV Photonics GFP
ISSN (Print)1949-2081

Other

Other2010 7th IEEE International Conference on Group IV Photonics, GFP 2010
CountryChina
CityBeijing
Period10/9/110/9/3

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Ceramics and Composites
  • Electronic, Optical and Magnetic Materials

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  • Cite this

    Kita, T., Abe, M., Ohtera, Y., & Yamada, H. (2010). Practical integration method of active devices on SOI photonic integrated circuits. In 2010 7th IEEE International Conference on Group IV Photonics, GFP 2010 (pp. 275-277). [5643354] (IEEE International Conference on Group IV Photonics GFP). https://doi.org/10.1109/GROUP4.2010.5643354