Post-processing gap reduction in a micromachined resonator for vacuum pressure measurement

Detlef Billep, Karla Hiller, Joerg Eckhardt Froemel, Dirk Tenholte, Danny Reuter, Wolfram Dötzef, Thomas Geßner

Research output: Contribution to journalConference articlepeer-review

1 Citation (Scopus)

Abstract

This paper describes the application of a micromachined resonator to verify the vacuum pressure and sealing of cavities in micromechanical components. We use an electrostatic driven and capacitively sensed bulk silicon resonator fabricated by Bonding and Deep Reactive Ion Etching (BDRIE) technology. The resonator operates at the first fundamental frequency. The damping is used as a degree of the pressure. Transversal comb structures act as squeeze film damping sources. Post-processing gap reduction substructures are used to increase the damping in the vacuum pressure range. This method makes it possible to observe the pressure over the time of smallest gas volumes by monitoring the damping of integrated micro mechanical resonant structures. Therewith it is possible to estimate the hermetic sealing quality of the closed sensor package. A transfer curve with a logarithmic characteristic is measured.

Original languageEnglish
Article number37
Pages (from-to)341-350
Number of pages10
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume5836
DOIs
Publication statusPublished - 2005 Dec 9
Externally publishedYes
EventSmart Sensors, Actuators, and MEMS II - Seville, Spain
Duration: 2005 May 92005 May 11

Keywords

  • High aspect ratio micromachining
  • Packaging
  • Post-processing gap reduction
  • Resonator
  • Vacuum pressure measurement

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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