Polydopamine and Its Composite Film as an Adhesion Layer for Cu Electroless Deposition on SiO2

Shih Cheng Chou, Wei An Chung, Tzu Ling Fan, Yezdi Dordi, Junichi Koike, Pu Wei Wu

Research output: Contribution to journalArticlepeer-review

5 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Polydopamine and Its Composite Film as an Adhesion Layer for Cu Electroless Deposition on SiO<sub>2</sub>'. Together they form a unique fingerprint.

Engineering & Materials Science

Chemical Compounds