Plastic-based receptacle-type VCSEL-array modules with one and two dimensions fabricated using the self-alignment mounting technique

Hideo Kosaka, Mikihiro Kajita, Mitsuki Yamada, Yoshimasa Sugimoto, Kazuhiko Kurata, Takashi Tanabe, Yasuhiko Kasukawa

Research output: Contribution to journalConference articlepeer-review

11 Citations (Scopus)

Abstract

We have developed one-dimensional and two-dimensional push/pull-receptacle-type vertical-cavity surface-emitting laser (VCSEL)-array modules. The one-dimensional (1-D) 8-channel module connects with a conventional mechanically-transferable multifiber push-on (MPO) fiber connector. For the two-dimensional (2-D) 16-channel module, we developed an 8×2 2-D push/pull fiber connector. These modules employ plastic-based receptacle packages directly joined to the fiber connector. After the VCSEL-array chip was self-aligned to the Si substrate by using flip-chip bonding, the substrate was also self-aligned to the package by using a self-alignment mounting machine. Optical coupling losses for the 1-D and the 2-D modules were respectively 2.1±0.4 and 2.1±0.8 dB. The modules were operated at a bit rate of 1 Gbps/ch without an isolator and showed floorless BER performance up to 70 °C. At 1 Gbps/ch their optical sensitivities were respectively -25.0 dBm±1.0 dB and -26.0 dBm±0.9 dB. These structures and techniques are applicable to high-density, high-throughput interconnection.

Original languageEnglish
Pages (from-to)382-390
Number of pages9
JournalProceedings - Electronic Components and Technology Conference
Publication statusPublished - 1997 Jan 1
EventProceedings of the 1997 47th IEEE Electronic Components & Technology Conference - San Jose, CA, USA
Duration: 1997 May 181997 May 21

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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