Plasma half dicing based on micro-loading effect for ultra-thin LiNbO3 plate wave devices on Si substrate

Yoshimi Yunoki, Michio Kadota, Masaaki Moriyama, Shuji Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Ultra-wide band ladder filters with bandwidth of 41 to 51%, which fully cover the digital TV band, were fabricated using 0-th shear horizontal (SH0) mode plate wave in a (0°, 117.5-120°, 0°) LiNbO3 (LN) ultra-thin plate. A LN/cavity/Si wafer with a number of devices must be separated into chips as they can be mounted on a printed circuit board (PCB). When the wafer is separated using a dicing machine, the wafer must be protected from strong water showers because the LN ultra-thin plate of 0.5 to 0.6 μm thickness on a cavity is fragile. In this study, the authors developed a new separating (plasma half dicing) method using the micro-loading effect instead of the conventional blade dicing. This method enjoys the advantages of dry process, and no additional etching is needed, because the half dicing grooves are fabricated simultaneously with the device cavities. A chip filter mounted on a PCB after separation shows a good frequency characteristic similar to the one measured using a prober system before separation.

Original languageEnglish
Title of host publication2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages168-171
Number of pages4
ISBN (Electronic)9781509019472
DOIs
Publication statusPublished - 2016 Nov 28
Event11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016 - Sendai, Japan
Duration: 2016 Apr 172016 Apr 20

Publication series

Name2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016

Other

Other11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016
CountryJapan
CitySendai
Period16/4/1716/4/20

Keywords

  • SH mode plate wave
  • cavity type device
  • micro-loading effect
  • plasma dicing method
  • ultra-thin plate

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Mechanical Engineering
  • Mechanics of Materials
  • Electronic, Optical and Magnetic Materials

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