Planer fabrication of multilayer piezoelectric actuator by groove cutting and electroplating

Gaku Suzuki; Masayoshi Esashi

Planer fabrication of multilayer piezoelectric actuator by groove cutting and electroplating

Gaku Suzuki, Masayoshi Esashi

Micro System Integration Center (μSIC)

Research output: Contribution to conference › Paper › peer-review

12 Citations (Scopus)

Abstract

This paper reports a new planer fabrication method of multilayer piezoelectric actuator. In this method, three techniques, dicing, electroplating and laser assisted etching (LAE), were used for constructing the multilayer structure. Prototype actuators with 23-120 active layers were fabricated in this method. The measured displacement was 2.5 μm (23 layers) and 7.3 μm (120 layers) at 100 V, respectively. These values agree with the calculated values from the piezoelectric properties of the material.

Original language	English
Pages	46-51
Number of pages	6
Publication status	Published - 2000 Jan 1
Event	13th Annual International Conference on Micro Electro Mechanical Systems (MEMS 2000) - Miyazaki, Jpn Duration: 2000 Jan 23 → 2000 Jan 27

Other

Other	13th Annual International Conference on Micro Electro Mechanical Systems (MEMS 2000)
City	Miyazaki, Jpn
Period	00/1/23 → 00/1/27

ASJC Scopus subject areas

Control and Systems Engineering
Electrical and Electronic Engineering
Mechanical Engineering

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title = "Planer fabrication of multilayer piezoelectric actuator by groove cutting and electroplating",

abstract = "This paper reports a new planer fabrication method of multilayer piezoelectric actuator. In this method, three techniques, dicing, electroplating and laser assisted etching (LAE), were used for constructing the multilayer structure. Prototype actuators with 23-120 active layers were fabricated in this method. The measured displacement was 2.5 μm (23 layers) and 7.3 μm (120 layers) at 100 V, respectively. These values agree with the calculated values from the piezoelectric properties of the material.",

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N2 - This paper reports a new planer fabrication method of multilayer piezoelectric actuator. In this method, three techniques, dicing, electroplating and laser assisted etching (LAE), were used for constructing the multilayer structure. Prototype actuators with 23-120 active layers were fabricated in this method. The measured displacement was 2.5 μm (23 layers) and 7.3 μm (120 layers) at 100 V, respectively. These values agree with the calculated values from the piezoelectric properties of the material.

AB - This paper reports a new planer fabrication method of multilayer piezoelectric actuator. In this method, three techniques, dicing, electroplating and laser assisted etching (LAE), were used for constructing the multilayer structure. Prototype actuators with 23-120 active layers were fabricated in this method. The measured displacement was 2.5 μm (23 layers) and 7.3 μm (120 layers) at 100 V, respectively. These values agree with the calculated values from the piezoelectric properties of the material.

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