Piezoelectric acoustic wave devices based on heterogeneous integration technology

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Piezoelectric acoustic wave devices are essential for most of electronics, and thus there should be merits of their integration with other components on chip scale. For this kind of integration, however, there are technical problems in terms of process temperature limit, thermal expansion mismatch, process incompatibility, die size mismatch etc. To overcome such problems, the wafer-to-wafer transfer of films and devices was adopted. The applications of hetero-geneously-integrated acoustic devices described here are mainly related to frequency selection and control for future wireless communication, network sensors etc.

Original languageEnglish
Title of host publicationIFCS 2014 - 2014 IEEE International Frequency Control Symposium, Proceedings
PublisherIEEE Computer Society
ISBN (Print)9781479949168
DOIs
Publication statusPublished - 2014 Jan 1
Event2014 IEEE International Frequency Control Symposium, IFCS 2014 - Taipei, Taiwan, Province of China
Duration: 2014 May 192014 May 22

Other

Other2014 IEEE International Frequency Control Symposium, IFCS 2014
CountryTaiwan, Province of China
CityTaipei
Period14/5/1914/5/22

ASJC Scopus subject areas

  • Control and Systems Engineering

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  • Cite this

    Tanaka, S. (2014). Piezoelectric acoustic wave devices based on heterogeneous integration technology. In IFCS 2014 - 2014 IEEE International Frequency Control Symposium, Proceedings [6859994] IEEE Computer Society. https://doi.org/10.1109/FCS.2014.6859994