Abstract
Piezoelectric acoustic wave devices are essential for most of electronics, and thus there should be merits of their integration with other components on chip scale. For this kind of integration, however, there are technical problems in terms of process temperature limit, thermal expansion mismatch, process incompatibility, die size mismatch etc. To overcome such problems, the wafer-to-wafer transfer of films and devices was adopted. The applications of hetero-geneously-integrated acoustic devices described here are mainly related to frequency selection and control for future wireless communication, network sensors etc.
| Original language | English |
|---|---|
| Title of host publication | IFCS 2014 - 2014 IEEE International Frequency Control Symposium, Proceedings |
| Publisher | IEEE Computer Society |
| ISBN (Print) | 9781479949168 |
| DOIs | |
| Publication status | Published - 2014 Jan 1 |
| Event | 2014 IEEE International Frequency Control Symposium, IFCS 2014 - Taipei, Taiwan, Province of China Duration: 2014 May 19 → 2014 May 22 |
Other
| Other | 2014 IEEE International Frequency Control Symposium, IFCS 2014 |
|---|---|
| Country | Taiwan, Province of China |
| City | Taipei |
| Period | 14/5/19 → 14/5/22 |
ASJC Scopus subject areas
- Control and Systems Engineering
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Cite this
Tanaka, S. (2014). Piezoelectric acoustic wave devices based on heterogeneous integration technology. In IFCS 2014 - 2014 IEEE International Frequency Control Symposium, Proceedings [6859994] IEEE Computer Society. https://doi.org/10.1109/FCS.2014.6859994