Piezoelectric acoustic wave devices based on heterogeneous integration technology

Shuji Tanaka

doi:10.1109/FCS.2014.6859994

Piezoelectric acoustic wave devices based on heterogeneous integration technology

Shuji Tanaka

ENG - Robotics

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

Piezoelectric acoustic wave devices are essential for most of electronics, and thus there should be merits of their integration with other components on chip scale. For this kind of integration, however, there are technical problems in terms of process temperature limit, thermal expansion mismatch, process incompatibility, die size mismatch etc. To overcome such problems, the wafer-to-wafer transfer of films and devices was adopted. The applications of hetero-geneously-integrated acoustic devices described here are mainly related to frequency selection and control for future wireless communication, network sensors etc.

Original language	English
Title of host publication	IFCS 2014 - 2014 IEEE International Frequency Control Symposium, Proceedings
Publisher	IEEE Computer Society
ISBN (Print)	9781479949168
DOIs	https://doi.org/10.1109/FCS.2014.6859994
Publication status	Published - 2014 Jan 1
Event	2014 IEEE International Frequency Control Symposium, IFCS 2014 - Taipei, Taiwan, Province of China Duration: 2014 May 19 → 2014 May 22

Other

Other	2014 IEEE International Frequency Control Symposium, IFCS 2014
Country	Taiwan, Province of China
City	Taipei
Period	14/5/19 → 14/5/22

ASJC Scopus subject areas

Control and Systems Engineering

Access to Document

10.1109/FCS.2014.6859994

Fingerprint Dive into the research topics of 'Piezoelectric acoustic wave devices based on heterogeneous integration technology'. Together they form a unique fingerprint.

Cite this

@inproceedings{a6a65c3f8fa4417c8d5c87fe3808fd47,

title = "Piezoelectric acoustic wave devices based on heterogeneous integration technology",

abstract = "Piezoelectric acoustic wave devices are essential for most of electronics, and thus there should be merits of their integration with other components on chip scale. For this kind of integration, however, there are technical problems in terms of process temperature limit, thermal expansion mismatch, process incompatibility, die size mismatch etc. To overcome such problems, the wafer-to-wafer transfer of films and devices was adopted. The applications of hetero-geneously-integrated acoustic devices described here are mainly related to frequency selection and control for future wireless communication, network sensors etc.",

author = "Shuji Tanaka",

year = "2014",

month = jan,

day = "1",

doi = "10.1109/FCS.2014.6859994",

language = "English",

isbn = "9781479949168",

booktitle = "IFCS 2014 - 2014 IEEE International Frequency Control Symposium, Proceedings",

publisher = "IEEE Computer Society",

note = "2014 IEEE International Frequency Control Symposium, IFCS 2014 ; Conference date: 19-05-2014 Through 22-05-2014",

}

TY - GEN

T1 - Piezoelectric acoustic wave devices based on heterogeneous integration technology

AU - Tanaka, Shuji

PY - 2014/1/1

Y1 - 2014/1/1

N2 - Piezoelectric acoustic wave devices are essential for most of electronics, and thus there should be merits of their integration with other components on chip scale. For this kind of integration, however, there are technical problems in terms of process temperature limit, thermal expansion mismatch, process incompatibility, die size mismatch etc. To overcome such problems, the wafer-to-wafer transfer of films and devices was adopted. The applications of hetero-geneously-integrated acoustic devices described here are mainly related to frequency selection and control for future wireless communication, network sensors etc.

AB - Piezoelectric acoustic wave devices are essential for most of electronics, and thus there should be merits of their integration with other components on chip scale. For this kind of integration, however, there are technical problems in terms of process temperature limit, thermal expansion mismatch, process incompatibility, die size mismatch etc. To overcome such problems, the wafer-to-wafer transfer of films and devices was adopted. The applications of hetero-geneously-integrated acoustic devices described here are mainly related to frequency selection and control for future wireless communication, network sensors etc.

UR - http://www.scopus.com/inward/record.url?scp=84906871347&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84906871347&partnerID=8YFLogxK

U2 - 10.1109/FCS.2014.6859994

DO - 10.1109/FCS.2014.6859994

M3 - Conference contribution

AN - SCOPUS:84906871347

SN - 9781479949168

BT - IFCS 2014 - 2014 IEEE International Frequency Control Symposium, Proceedings

PB - IEEE Computer Society

T2 - 2014 IEEE International Frequency Control Symposium, IFCS 2014

Y2 - 19 May 2014 through 22 May 2014

ER -

Piezoelectric acoustic wave devices based on heterogeneous integration technology

Abstract

Other

ASJC Scopus subject areas

Access to Document

Other files and links

Cite this