Piezoelectric acoustic wave devices based on heterogeneous integration technology

Shuji Tanaka

doi:10.1109/FCS.2014.6859994

Piezoelectric acoustic wave devices based on heterogeneous integration technology

Shuji Tanaka

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

Piezoelectric acoustic wave devices are essential for most of electronics, and thus there should be merits of their integration with other components on chip scale. For this kind of integration, however, there are technical problems in terms of process temperature limit, thermal expansion mismatch, process incompatibility, die size mismatch etc. To overcome such problems, the wafer-to-wafer transfer of films and devices was adopted. The applications of hetero-geneously-integrated acoustic devices described here are mainly related to frequency selection and control for future wireless communication, network sensors etc.

Original language	English
Title of host publication	IFCS 2014 - 2014 IEEE International Frequency Control Symposium, Proceedings
Publisher	IEEE Computer Society
ISBN (Print)	9781479949168
DOIs	https://doi.org/10.1109/FCS.2014.6859994
Publication status	Published - 2014 Jan 1
Externally published	Yes
Event	2014 IEEE International Frequency Control Symposium, IFCS 2014 - Taipei, Taiwan, Province of China Duration: 2014 May 19 → 2014 May 22

Other

Other	2014 IEEE International Frequency Control Symposium, IFCS 2014
Country/Territory	Taiwan, Province of China
City	Taipei
Period	14/5/19 → 14/5/22

ASJC Scopus subject areas

Control and Systems Engineering

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10.1109/FCS.2014.6859994

Cite this

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title = "Piezoelectric acoustic wave devices based on heterogeneous integration technology",

abstract = "Piezoelectric acoustic wave devices are essential for most of electronics, and thus there should be merits of their integration with other components on chip scale. For this kind of integration, however, there are technical problems in terms of process temperature limit, thermal expansion mismatch, process incompatibility, die size mismatch etc. To overcome such problems, the wafer-to-wafer transfer of films and devices was adopted. The applications of hetero-geneously-integrated acoustic devices described here are mainly related to frequency selection and control for future wireless communication, network sensors etc.",

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N2 - Piezoelectric acoustic wave devices are essential for most of electronics, and thus there should be merits of their integration with other components on chip scale. For this kind of integration, however, there are technical problems in terms of process temperature limit, thermal expansion mismatch, process incompatibility, die size mismatch etc. To overcome such problems, the wafer-to-wafer transfer of films and devices was adopted. The applications of hetero-geneously-integrated acoustic devices described here are mainly related to frequency selection and control for future wireless communication, network sensors etc.

AB - Piezoelectric acoustic wave devices are essential for most of electronics, and thus there should be merits of their integration with other components on chip scale. For this kind of integration, however, there are technical problems in terms of process temperature limit, thermal expansion mismatch, process incompatibility, die size mismatch etc. To overcome such problems, the wafer-to-wafer transfer of films and devices was adopted. The applications of hetero-geneously-integrated acoustic devices described here are mainly related to frequency selection and control for future wireless communication, network sensors etc.

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T2 - 2014 IEEE International Frequency Control Symposium, IFCS 2014

Y2 - 19 May 2014 through 22 May 2014

ER -

Piezoelectric acoustic wave devices based on heterogeneous integration technology

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