Pico-thermogravimetric material properties analysis using diamond cantilever beam

Ioana Voiculescu, Masaya Toda, Meiyong Liao, Takahito Ono

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents a novel technique for pico-thermo gravimetric analysis of material properties using diamond cantilever beam. The thermal decomposition of calcium carbonate (CaCO3) was examined using this method. The diamond cantilever beam with CaCO3 attached on the tip was introduced in a thermal chamber and the temperature was raised to 600°C. The cantilever beam was vibrated and the resonant frequency was monitored in real time during the thermal process. From the resonant frequency behavior, there was evidence that the thermal conversion from CaCO3 to CaO starts around 500°C. The novel technique used very small amount of material and variations of the analyzed material pico-mass can be observed from the cantilever beam measurements. The information about the conversion temperature was highly accurate.

Original languageEnglish
Title of host publicationTRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages2223-2226
Number of pages4
ISBN (Electronic)9781538627310
DOIs
Publication statusPublished - 2017 Jul 26
Event19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017 - Kaohsiung, Taiwan, Province of China
Duration: 2017 Jun 182017 Jun 22

Publication series

NameTRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems

Other

Other19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017
CountryTaiwan, Province of China
CityKaohsiung
Period17/6/1817/6/22

Keywords

  • diamond cantilever beam
  • pico-thermogravimetric analysis
  • quality factor
  • resonant frequency

ASJC Scopus subject areas

  • Chemical Health and Safety
  • Instrumentation
  • Electrical and Electronic Engineering

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