Photon counting X-ray imager with four-sides buttable structure

Toshiyuki Takagi, Katsuyuki Takagi, Tsuyoshi Terao, Hisashi Morii, Takaharu Okunoyama, Hiroki Kase, Akifumi Koike, Toru Aoki

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A new photon counting X-ray imager with a 4-sided buttable structure is proposed. The imager consists of a stacked structure of a semiconductor detector such as Cadmium Telluride detector and a Si-based Read-Out Integrated Circuit (ROIC). The imager can be arranged in two dimensions with small gaps of less than 100 μm, because input/output pads of the ROIC are located on the back using through silicon via technology. In addition, daisy-chaining between imagers extends the number of tilings without increasing the number of external connections. This allows to connect small imagers to achieve a larger imaging area.

Original languageEnglish
Title of host publicationPhotonic Instrumentation Engineering VIII
EditorsYakov Soskind, Lynda E. Busse
PublisherSPIE
ISBN (Electronic)9781510642218
DOIs
Publication statusPublished - 2021
Externally publishedYes
EventPhotonic Instrumentation Engineering VIII 2021 - Virtual, Online, United States
Duration: 2021 Mar 62021 Mar 11

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume11693
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Conference

ConferencePhotonic Instrumentation Engineering VIII 2021
Country/TerritoryUnited States
CityVirtual, Online
Period21/3/621/3/11

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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