Phenyl silica glass for formation of porous dielectric film

Kazuhiko Endo, Keisuke Shinoda, Toru Tatsumi

Research output: Contribution to journalConference articlepeer-review

Abstract

Phenyl and alkyl groups were introduced into silica glass in order to prevent the formation of a Si-O network and reduce its density and to reduce the dielectric constant of the glass. In this regard, the phenyl group was more effective than the alkyl group. The measured Si-O intensity of FTIR spectrum of the glass with introduced phenyl was only 14% of thermal SiO2 film, however, the thermally stable carbon component prevented further reduction in density after 400°C annealing.

Original languageEnglish
Pages (from-to)49-54
Number of pages6
JournalMaterials Research Society Symposium - Proceedings
Volume565
Publication statusPublished - 1999 Dec 1
Externally publishedYes
EventThe 1999 MRS Spring Meeting - Symposium O 'Low-Dielectric Constant Materials V' - San Francisco, CA, USA
Duration: 1999 Apr 51999 Apr 8

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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