TY - GEN
T1 - Performance of flexible noise suppressor for IoT devices made only of meltblown non-woven fabric
AU - Yamaguchi, Masahiro
AU - Fu, Jiang
AU - Tanaka, Tomoya
AU - Okamura, Chie
AU - Obi, Lumina
AU - Kato, Kazufumi
AU - Muroga, Sho
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/7/11
Y1 - 2017/7/11
N2 - This paper discusses electromagnetic noise suppression performance of less-than 50 μm-thick in total and flexible meltblown non-woven fabric. New sets of lighter fabric of 10 g/m2 has been developed, and its performance were compared with commercially available 98 g/m2 fabric and referential 20 g/m2 test samples. As the sheet resistance becomes the less and accordingly the loss ration becomes higher as the pressure during fabrication increases, and as the heat treatment is applied to weld the fibers. Effect of contact resistance is significant, as in the case of 20 g/m2 test samples The noise suppression performance was as high as commercially available 98 g/m2 fabric whereas the thickness is less-than one-third and the per-unit-area weight is one-tenth of the commercially available fabric.
AB - This paper discusses electromagnetic noise suppression performance of less-than 50 μm-thick in total and flexible meltblown non-woven fabric. New sets of lighter fabric of 10 g/m2 has been developed, and its performance were compared with commercially available 98 g/m2 fabric and referential 20 g/m2 test samples. As the sheet resistance becomes the less and accordingly the loss ration becomes higher as the pressure during fabrication increases, and as the heat treatment is applied to weld the fibers. Effect of contact resistance is significant, as in the case of 20 g/m2 test samples The noise suppression performance was as high as commercially available 98 g/m2 fabric whereas the thickness is less-than one-third and the per-unit-area weight is one-tenth of the commercially available fabric.
KW - contact resistance
KW - meltbrwon non-woven fabric
KW - noise suppressor
KW - non-woven fabric
KW - sheet resistance
UR - http://www.scopus.com/inward/record.url?scp=85027587780&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85027587780&partnerID=8YFLogxK
U2 - 10.1109/APEMC.2017.7975414
DO - 10.1109/APEMC.2017.7975414
M3 - Conference contribution
AN - SCOPUS:85027587780
T3 - 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2017
SP - 25
EP - 27
BT - 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2017
Y2 - 20 June 2017 through 23 June 2017
ER -