Parallel data inspection operation in three-dimensional content addressable memory with optical interconnection

H. Okano, H. Takata, T. Nakano, T. Tanaka, S. Miyazaki, M. Hirose, H. Tsukamoto, S. Yokoyama, R. Aibara, M. Koyanagi

Research output: Contribution to conferencePaperpeer-review

Abstract

Three-dimensional content addressable memory with optical interconnection (3D-OCAM) has been proposed for the new parallel processing computer system. The 3D-OCAM is used to control the data transfer among many memory layers of three-dimensional memory LSI in this system. The vertical and horizontal data inspection operations among many memory layers are simultaneously implemented in 3D-OCAM. The test chip of 3D-OCAM was fabricated and its basic parallel inspection operation was successfully demonstrated.

Original languageEnglish
Pages592-594
Number of pages3
DOIs
Publication statusPublished - 1992
EventExtended Abstracts of the 1992 International Conference on Solid State Devices and Materials - SSDM '92 - Tsukuba, Jpn
Duration: 1992 Aug 261992 Aug 28

Other

OtherExtended Abstracts of the 1992 International Conference on Solid State Devices and Materials - SSDM '92
CityTsukuba, Jpn
Period92/8/2692/8/28

ASJC Scopus subject areas

  • Engineering(all)

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