Three-dimensional content addressable memory with optical interconnection (3D-OCAM) has been proposed for the new parallel processing computer system. The 3D-OCAM is used to control the data transfer among many memory layers of three-dimensional memory LSI in this system. The vertical and horizontal data inspection operations among many memory layers are simultaneously implemented in 3D-OCAM. The test chip of 3D-OCAM was fabricated and its basic parallel inspection operation was successfully demonstrated.
|Number of pages||3|
|Publication status||Published - 1992 Dec 1|
|Event||Extended Abstracts of the 1992 International Conference on Solid State Devices and Materials - SSDM '92 - Tsukuba, Jpn|
Duration: 1992 Aug 26 → 1992 Aug 28
|Other||Extended Abstracts of the 1992 International Conference on Solid State Devices and Materials - SSDM '92|
|Period||92/8/26 → 92/8/28|
ASJC Scopus subject areas