Packaging technology for high temperature operation of power semiconductor modules

Akira Morozumi, Yoshitaka Nishimura, Yoshinari Ikeda, Eiji Mochizuki, Yoshikazu Takahashi

Research output: Contribution to journalArticle

1 Citation (Scopus)
Original languageEnglish
Pages (from-to)464-468
Number of pages5
JournalJournal of Japan Institute of Electronics Packaging
Volume17
Issue number6
DOIs
Publication statusPublished - 2014 Jan 1
Externally publishedYes

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this