Packaged micro mechanical sensors were fabricated using glass-silicon anodic bonding and an electrical feedthrough structure. Two parallel plates which can be used not only for capacitive sensors but also electrostatic actuators are adopted for integrated sensors as capacitive pressure sensors, accelerometers and resonating sensors. Micromachining technologies were developed for these packaged micro sensors. These include laser assisted silicon etching and anodic bonding which enables to incorporate a circuit inside the package and to keep a sealed cavity at a high vacuum.
|Number of pages||8|
|Publication status||Published - 1994 Dec 1|
|Event||Proceedings of the 1994 IEEE Symposium on Emerging Technologies & Factory Automation - Tokyo, Jpn|
Duration: 1994 Nov 6 → 1994 Nov 10
|Other||Proceedings of the 1994 IEEE Symposium on Emerging Technologies & Factory Automation|
|Period||94/11/6 → 94/11/10|
ASJC Scopus subject areas