Packaged micromechanical sensors

Masayoshi Esashi, Kazuyuki Minami

Research output: Contribution to conferencePaperpeer-review

2 Citations (Scopus)

Abstract

Packaged micro mechanical sensors were fabricated using glass-silicon anodic bonding and an electrical feedthrough structure. Two parallel plates which can be used not only for capacitive sensors but also electrostatic actuators are adopted for integrated sensors as capacitive pressure sensors, accelerometers and resonating sensors. Micromachining technologies were developed for these packaged micro sensors. These include laser assisted silicon etching and anodic bonding which enables to incorporate a circuit inside the package and to keep a sealed cavity at a high vacuum.

Original languageEnglish
Pages30-37
Number of pages8
Publication statusPublished - 1994 Dec 1
EventProceedings of the 1994 IEEE Symposium on Emerging Technologies & Factory Automation - Tokyo, Jpn
Duration: 1994 Nov 61994 Nov 10

Other

OtherProceedings of the 1994 IEEE Symposium on Emerging Technologies & Factory Automation
CityTokyo, Jpn
Period94/11/694/11/10

ASJC Scopus subject areas

  • Engineering(all)

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