Pack cementation treatment of titanium using tetracalcium phosphate powder for biomedical applications

Kyosuke Ueda, Hajime Suto, Kaori Nakaie, Takayuki Narushima

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The surface modification of commercially pure titanium (CP Ti) by pack cementation treatment at 973 K using tetracalcium phosphate (Ca 4(PO4)2O, TTCP) slurry was investigated. An HAp phase and a CaTiO3 phase were observed on the reaction layer of the CP Ti substrate after pack cementation treatment at 973 K for 86.4 ks. TTCP powder decomposed to HAp and CaO, and CaO reacted with TiO2 to form CaTiO3. The reaction layer on the CP Ti substrate consisted of inner and outer layers and the particles were in the outer reaction layer. The pores observed on the reaction layer were formed by the detachment of particles from the outer layer. The bonding strength of the reaction layer was 68.1 MPa. Apatite completely covered the surface of the pack-cementation-treated CP Ti after immersion in Kokubo solution for 21.6 ks; such rapid apatite formation suggests that pack cementation treatment improves the biocompatibility of titanium.

Original languageEnglish
Title of host publicationPRICM7
PublisherTrans Tech Publications Ltd
Pages2172-2175
Number of pages4
ISBN (Print)0878492550, 9780878492558
DOIs
Publication statusPublished - 2010
Event7th Pacific Rim International Conference on Advanced Materials and Processing, PRICM-7 - Cairns, QLD, Australia
Duration: 2010 Aug 22010 Aug 6

Publication series

NameMaterials Science Forum
Volume654-656
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752

Other

Other7th Pacific Rim International Conference on Advanced Materials and Processing, PRICM-7
CountryAustralia
CityCairns, QLD
Period10/8/210/8/6

Keywords

  • Immersion test
  • Pack cementation treatment
  • Tetracalcium phosphate
  • Titanium

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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