Oxidation mechanism of Cu2O to CuO at 600-1050 °C

Y. Zhu, Koji Mimura, M. Isshiki

Research output: Contribution to journalReview articlepeer-review

90 Citations (Scopus)

Abstract

To clarify the oxidation mechanism □□2□ to CuO, □□2□ oxidation was studied at 600-1050°C under1 atm □2. The □□2□ specimens were prepared through completely oxidizing 99.99999 and 99.5% pure copper at 1000°C in an Ar +1% □2 atmosphere. The oxidation kinetics □□ 2□ specimens prepared from both purity levels followed the logarithmic law, not the parabolic law or the cubic law as reported in the literature. The activation energy for □□2□ oxidation is relatively high in the lower-temperature range, but becomes very small or even negative at higher temperatures. The logarithmic oxidation rate law can be explained by Davies et al.'s model related to grain-boundary diffusion in the oxide layers. The very small or negative activation energies in the higher-temperature range can be attributed to the very small thermodynamic driving force and the fast lateral growth of CuO grains related to a sintering effect. The influence of small amount of impurities is also discussed.

Original languageEnglish
Pages (from-to)207-222
Number of pages16
JournalOxidation of Metals
Volume62
Issue number3-4
DOIs
Publication statusPublished - 2004 Oct 1

Keywords

  • Activation energies
  • CuO
  • CuO
  • Grain-boundary diffusion
  • Oxidation
  • Oxidation rate law

ASJC Scopus subject areas

  • Metals and Alloys

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