Outgassing study of thin films used for poly-SiGe based vacuum packaging of MEMS

B. Wang, S. Tanaka, B. Guo, G. Vereecke, S. Severi, A. Witvrouw, M. Wevers, I. De Wolf

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

MEMs typically have moving parts that are sensitive to the environmental pressure during operation. Many types of microsystem devices need vacuum in order to operate properly. However, making a high vacuum MEMS package, which maintains this vacuum over a long time, is difficult. Sources of gas inside a MEMS package are mainly due to external leakage or in-diffusion and/or internal materials outgassing. This paper reports on a systematical study of the outgassing properties of typical materials (Table 1) used for imec's polycrystalline silicon-germanium (poly-SiGe) based MEMS thin film vacuum package technology.

Original languageEnglish
Title of host publication2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2012
DOIs
Publication statusPublished - 2012
Event2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2012 - Singapore, Singapore
Duration: 2012 Jul 22012 Jul 6

Publication series

NameProceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

Other

Other2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2012
CountrySingapore
CitySingapore
Period12/7/212/7/6

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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