Optimizing pad groove design and polishing kinematics for reduced shear force, low force fluctuation and optimum removal rate attributes of copper CMP

Yasa Sampurno, Ara Philipossian, Sian Theng, Takenao Nemoto, Xun Gu, Yun Zhuang, Akinobu Teramoto, Tadahiro Ohmi

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Fingerprint

Dive into the research topics of 'Optimizing pad groove design and polishing kinematics for reduced shear force, low force fluctuation and optimum removal rate attributes of copper CMP'. Together they form a unique fingerprint.

Chemical Compounds

Physics & Astronomy

Engineering & Materials Science