Optimization of vertical interconnection in 3D LSI using wire-length distribution

T. Nakamura, Y. Yamada, T. Ono, J. C. Shim, H. Kurino, M. Koyanagi

Research output: Contribution to journalConference articlepeer-review

2 Citations (Scopus)

Abstract

In this paper, the model for wire length distribution model in three dimensional LSI is derived using Rent's rule. The number of the vertical interconnections and the ratio in all of wirings can be calculated with this model. This model clearly shows that many vertical interconnections are effectively utilized in chips with high Rent's constant p. We also evaluate the vertical interconnection density and the occupied area by the vertical interconnection in a chip.

Original languageEnglish
Pages (from-to)35-43
Number of pages9
JournalAdvanced Metallization Conference (AMC)
Publication statusPublished - 2003
EventAdvanced Metallization Conference 2003, AMC 2003 - Montreal, Que., Canada
Duration: 2003 Oct 212003 Oct 23

ASJC Scopus subject areas

  • Chemical Engineering(all)

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