Optimization of source-drain contact process with Cu-Mn alloys

Junichi Koike, M. Sano, K. Hirota, Yuji Suto, K. Neishi

Research output: Contribution to conference › Paper › peer-review

Abstract

Cu-Mn alloy was deposited as a source-drain electrode on plasma-oxidized amorphous Si substrates. The oxidation conditions were optimized successfully to obtain a good diffusion barrier property, adhesion strength, and Ohmic contact.

Original languageEnglish
Pages275-277
Number of pages3
Publication statusPublished - 2009 Dec 1
Event16th International Display Workshops, IDW '09 - Miyazaki, Japan
Duration: 2009 Dec 9 → 2009 Dec 11

Other

Other16th International Display Workshops, IDW '09
CountryJapan
CityMiyazaki
Period09/12/9 → 09/12/11

ASJC Scopus subject areas

  • Hardware and Architecture
  • Human-Computer Interaction
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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