Optimization of a mechanical bridge joint structure in a stacked HTS conductor

Kenji Kawai, Satoshi Ito, Yutaro Seino, Nagato Yanagi, Hitoshi Tamura, Akio Sagara, Hidetoshi Hashizume

Research output: Contribution to journalArticlepeer-review

19 Citations (Scopus)

Abstract

The mechanical bridge joint (bridge-type lap joint) of a stacked high-temperature superconducting conductor has been investigated for a “remountable” or a segment-fabricated high-temperature superconducting magnet. In a previous study, joint resistivities were evaluated experimentally for the bridge joints of single-layer and double-layer stacked GdBCO coated conductors. However, the joint resistivity increased with an increase in the number of layers due to nonuniform contact pressure distribution caused by a gap or misalignment in the joint region. In this study, therefore, we were aiming at the reduction of joint resistance by achieving more uniform contact pressure distribution. In addition, we investigated the effects of temperature while applying pressure to the joint and positioning the joint structure to investigate its application in an actual large-sized magnet. First, we inserted an indium film between the joint surfaces to make contact pressure uniform. Experimental results showed that joint resistivity with the indium film did not depend on the number of layers. In addition, applying force at room temperature was more effective in decreasing joint resistivity than that at 77 K. Finally, we examined the effect of the joint structure with screw bolt tightening. The result showed that the structure of the convex plate has better joint performance than others.

Original languageEnglish
Article number2239335
JournalIEEE Transactions on Applied Superconductivity
Volume23
Issue number3
DOIs
Publication statusPublished - 2013 Jan 1

Keywords

  • Fusion reactors
  • High-temperature superconductors
  • Power cable connecting
  • Superconducting magnets

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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