Optimal heating control condition to unify hear flux on a wafer during rapid thermal processing with lamp heaters

Shigeki Hirasawa, Tadashi Suzuki, Shigenao Maruyama

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

To unify heat flux on a wafer during rapid thermal processing with lamp heaters, we developed a rapid computation technique to find the optimum conditions for controlling lamp heating rate. Box's method was used to optimize heating rate by repeatedly calculating distributions of heat flux on the wafer by using 3D radiative heat transfer analysis program. Calculation results show that the minimum distribution of heat flux on the wafer is 1.5% at a heat-up condition of 100°C/s and 4-zones control of 16 rod-type lamps. The minimum heat flux on the wafer is 210 W/m2 (so the temperature difference in the wafer is 0.5°C) at a steady state at 1000°C. This minimum heat flux is 1/15 times of that produced by non-controlled heating with the same lamps.

Original languageEnglish
Pages (from-to)2163-2166
Number of pages4
JournalNippon Kikai Gakkai Ronbunshu, B Hen/Transactions of the Japan Society of Mechanical Engineers, Part B
Volume68
Issue number671
DOIs
Publication statusPublished - 2002 Jul

Keywords

  • Furnace
  • Heat treatment
  • Numerical analysis
  • Optimal control
  • Thermal radiation
  • Wafer

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Mechanical Engineering

Fingerprint Dive into the research topics of 'Optimal heating control condition to unify hear flux on a wafer during rapid thermal processing with lamp heaters'. Together they form a unique fingerprint.

  • Cite this