Optical interposer technology using buried vertical-cavity surface-emitting laser chip and tapered through-silicon via for high-speed chip-to-chip optical interconnection

Akihiro Noriki, Makoto Fujiwara, Kang Wook Lee, Woo Cheol Jeong, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

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5 Citations (Scopus)

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Engineering & Materials Science

Physics & Astronomy