On the wafer-level assembly of multi-component MOEMS devices

Chenping Jia, Jörg Frömel, Maik Wiemer, Thomas Gessner, Sylwester Bargiel, Nicolas Passilly, Christophe Gorecki

Research output: Contribution to conferencePaper

Abstract

In this paper, we will demonstrate a new strategy for the assembly of multi-component micro optical system at wafer-level. First, the individual elements of the micro optical system are prepared on silicon or glass wafers separately. After that, sequential anodic bonding steps are performed to join these functional modules together. In case of need, discrete components such as micro lens are mounted on corresponding platforms by using heat-resistant glass-frit. Finally, hermetic sealing of the overall system is achieved by doing the last bonding step under vacuum condition. The feasibility of this method has been validated by initial test experiments.

Original languageEnglish
Publication statusPublished - 2012 Jan 1
Externally publishedYes
EventSmart Systems Integration Conference 2012, SSI 2012 - Zurich, Switzerland
Duration: 2012 Mar 212012 Mar 22

Conference

ConferenceSmart Systems Integration Conference 2012, SSI 2012
CountrySwitzerland
CityZurich
Period12/3/2112/3/22

ASJC Scopus subject areas

  • Artificial Intelligence
  • Computer Networks and Communications
  • Computer Science Applications

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  • Cite this

    Jia, C., Frömel, J., Wiemer, M., Gessner, T., Bargiel, S., Passilly, N., & Gorecki, C. (2012). On the wafer-level assembly of multi-component MOEMS devices. Paper presented at Smart Systems Integration Conference 2012, SSI 2012, Zurich, Switzerland.