On-chip integrated magnetic thin-film solution to countermeasure digital noise on RF IC

Masahiro Yamaguchi; Satoshi Tanaka; Yasushi Endo; Sho Muroga; Makoto Nagata

doi:10.1109/APEMC.2015.7175409

On-chip integrated magnetic thin-film solution to countermeasure digital noise on RF IC

Masahiro Yamaguchi, Satoshi Tanaka, Yasushi Endo, Sho Muroga, Makoto Nagata

ENG - Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

12 Citations (Scopus)

Abstract

Crossed anisotropy amorphous Co₈₅Zr₃Nb₁₂ thin film with total magnetic thickness of 2.0 μm is deposited on to the passivation of a test IC chip to accommodate intra IC chip level digital-to-RF noise suppression and telecommunication performance simultaneously. This technology is applicable to other frequency band in 0.41 to 3 GHz by using Co_85-(x+y)Zr_3+xNb_12+y(x: 0-5.5, y: 0-11.0) film. In-band spurious tone is attenuated by 10 dB and the minimum input power level to meet the 3GPP criteria is improved by 8 dB. Intra electromagnetic coupling analysis from digital to RF circuits within the bandwidth of wireless channels have clarified that the magnetic film suppressed conduction noise in on-chip wires.

Original language	English
Title of host publication	2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	536-539
Number of pages	4
ISBN (Electronic)	9781479966707
DOIs	https://doi.org/10.1109/APEMC.2015.7175409
Publication status	Published - 2015 Aug 3
Event	Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015 - Taipei, Taiwan, Province of China Duration: 2015 May 25 → 2015 May 29

Publication series

Name	2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015

Other

Other	Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015
Country/Territory	Taiwan, Province of China
City	Taipei
Period	15/5/25 → 15/5/29

ASJC Scopus subject areas

Electrical and Electronic Engineering
Radiation

Access to Document

10.1109/APEMC.2015.7175409

Cite this

Yamaguchi, M., Tanaka, S., Endo, Y., Muroga, S., & Nagata, M. (2015). On-chip integrated magnetic thin-film solution to countermeasure digital noise on RF IC. In 2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015 (pp. 536-539). [7175409] (2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/APEMC.2015.7175409

On-chip integrated magnetic thin-film solution to countermeasure digital noise on RF IC. / Yamaguchi, Masahiro; Tanaka, Satoshi; Endo, Yasushi; Muroga, Sho; Nagata, Makoto.

2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015. Institute of Electrical and Electronics Engineers Inc., 2015. p. 536-539 7175409 (2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Yamaguchi, M, Tanaka, S, Endo, Y, Muroga, S & Nagata, M 2015, On-chip integrated magnetic thin-film solution to countermeasure digital noise on RF IC. in 2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015., 7175409, 2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015, Institute of Electrical and Electronics Engineers Inc., pp. 536-539, Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015, Taipei, Taiwan, Province of China, 15/5/25. https://doi.org/10.1109/APEMC.2015.7175409

Yamaguchi M, Tanaka S, Endo Y, Muroga S, Nagata M. On-chip integrated magnetic thin-film solution to countermeasure digital noise on RF IC. In 2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015. Institute of Electrical and Electronics Engineers Inc. 2015. p. 536-539. 7175409. (2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015). https://doi.org/10.1109/APEMC.2015.7175409

Yamaguchi, Masahiro ; Tanaka, Satoshi ; Endo, Yasushi ; Muroga, Sho ; Nagata, Makoto. / On-chip integrated magnetic thin-film solution to countermeasure digital noise on RF IC. 2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015. Institute of Electrical and Electronics Engineers Inc., 2015. pp. 536-539 (2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015).

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abstract = "Crossed anisotropy amorphous Co85Zr3Nb12 thin film with total magnetic thickness of 2.0 μm is deposited on to the passivation of a test IC chip to accommodate intra IC chip level digital-to-RF noise suppression and telecommunication performance simultaneously. This technology is applicable to other frequency band in 0.41 to 3 GHz by using Co85-(x+y)Zr3+xNb12+y(x: 0-5.5, y: 0-11.0) film. In-band spurious tone is attenuated by 10 dB and the minimum input power level to meet the 3GPP criteria is improved by 8 dB. Intra electromagnetic coupling analysis from digital to RF circuits within the bandwidth of wireless channels have clarified that the magnetic film suppressed conduction noise in on-chip wires.",

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N2 - Crossed anisotropy amorphous Co85Zr3Nb12 thin film with total magnetic thickness of 2.0 μm is deposited on to the passivation of a test IC chip to accommodate intra IC chip level digital-to-RF noise suppression and telecommunication performance simultaneously. This technology is applicable to other frequency band in 0.41 to 3 GHz by using Co85-(x+y)Zr3+xNb12+y(x: 0-5.5, y: 0-11.0) film. In-band spurious tone is attenuated by 10 dB and the minimum input power level to meet the 3GPP criteria is improved by 8 dB. Intra electromagnetic coupling analysis from digital to RF circuits within the bandwidth of wireless channels have clarified that the magnetic film suppressed conduction noise in on-chip wires.

AB - Crossed anisotropy amorphous Co85Zr3Nb12 thin film with total magnetic thickness of 2.0 μm is deposited on to the passivation of a test IC chip to accommodate intra IC chip level digital-to-RF noise suppression and telecommunication performance simultaneously. This technology is applicable to other frequency band in 0.41 to 3 GHz by using Co85-(x+y)Zr3+xNb12+y(x: 0-5.5, y: 0-11.0) film. In-band spurious tone is attenuated by 10 dB and the minimum input power level to meet the 3GPP criteria is improved by 8 dB. Intra electromagnetic coupling analysis from digital to RF circuits within the bandwidth of wireless channels have clarified that the magnetic film suppressed conduction noise in on-chip wires.

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On-chip integrated magnetic thin-film solution to countermeasure digital noise on RF IC

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