TY - GEN
T1 - On-chip integrated magnetic thin-film solution to countermeasure digital noise on RF IC
AU - Yamaguchi, Masahiro
AU - Tanaka, Satoshi
AU - Endo, Yasushi
AU - Muroga, Sho
AU - Nagata, Makoto
N1 - Publisher Copyright:
© 2015 IEEE.
PY - 2015/8/3
Y1 - 2015/8/3
N2 - Crossed anisotropy amorphous Co85Zr3Nb12 thin film with total magnetic thickness of 2.0 μm is deposited on to the passivation of a test IC chip to accommodate intra IC chip level digital-to-RF noise suppression and telecommunication performance simultaneously. This technology is applicable to other frequency band in 0.41 to 3 GHz by using Co85-(x+y)Zr3+xNb12+y(x: 0-5.5, y: 0-11.0) film. In-band spurious tone is attenuated by 10 dB and the minimum input power level to meet the 3GPP criteria is improved by 8 dB. Intra electromagnetic coupling analysis from digital to RF circuits within the bandwidth of wireless channels have clarified that the magnetic film suppressed conduction noise in on-chip wires.
AB - Crossed anisotropy amorphous Co85Zr3Nb12 thin film with total magnetic thickness of 2.0 μm is deposited on to the passivation of a test IC chip to accommodate intra IC chip level digital-to-RF noise suppression and telecommunication performance simultaneously. This technology is applicable to other frequency band in 0.41 to 3 GHz by using Co85-(x+y)Zr3+xNb12+y(x: 0-5.5, y: 0-11.0) film. In-band spurious tone is attenuated by 10 dB and the minimum input power level to meet the 3GPP criteria is improved by 8 dB. Intra electromagnetic coupling analysis from digital to RF circuits within the bandwidth of wireless channels have clarified that the magnetic film suppressed conduction noise in on-chip wires.
UR - http://www.scopus.com/inward/record.url?scp=84964031630&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84964031630&partnerID=8YFLogxK
U2 - 10.1109/APEMC.2015.7175409
DO - 10.1109/APEMC.2015.7175409
M3 - Conference contribution
AN - SCOPUS:84964031630
T3 - 2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015
SP - 536
EP - 539
BT - 2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015
Y2 - 25 May 2015 through 29 May 2015
ER -