On-chip checkpointing with 3D-stacked memories

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Since deep-submicron process technologies induce soft errors, advanced computing systems face a low dependability problem. Checkpointing, which copies data required for continuing the program execution as a backup, is expected as a promising approach to keeping a high dependability. However, checkpointing causes additional memory accesses, which cause performance and energy overheads. To reduce these overheads, this paper focuses on 3D-stacking technologies. Since the technologies realize large on-chip memories with a short latency and a high bandwidth, the overheads of checkpointing are expected to decrease. In order to examine the reduction of the overheads, this paper supposes a future 3D-stacked processor-memory module, and proposes an on-chip checkpointing mechanism. The evaluation results indicate that the on-chip checkpointing with 3D-stacked memories can reduce the execution time by 15% and energy consumption by 26% on average, compared with the checkpointing mechanism with off-chip memories.

Original languageEnglish
Title of host publication2014 International 3D Systems Integration Conference, 3DIC 2014 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781479984725
DOIs
Publication statusPublished - 2014 Jan 1
EventInternational 3D Systems Integration Conference, 3DIC 2014 - Kinsdale, Ireland
Duration: 2014 Dec 12014 Dec 3

Publication series

Name2014 International 3D Systems Integration Conference, 3DIC 2014 - Proceedings

Other

OtherInternational 3D Systems Integration Conference, 3DIC 2014
Country/TerritoryIreland
CityKinsdale
Period14/12/114/12/3

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Hardware and Architecture

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