On-chip and on-board RF noise coupling and impacts on LTE wireless communication performance (Invited)

Makoto Nagata, Noriyuki Miura, Sho Muroga, Satoshi Tanaka, Masahiro Yamaguchi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In-band interferers due to noise coupling from baseband digital circuits significantly impact on the wireless communication performance, in the case of single-chip system-level integration. The on-chip and off-chip (on-board) noise coupling are measured for visualizing the noise couplings. In addition, the hardware-in-the-loop simulation (HILS) estimates their impacts on the performance metrics like throughputs, under the interactions of interferers with the operation of LTE-compliant RF receiver circuits in a 65 nm CMOS technology.

Original languageEnglish
Title of host publication2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages7-9
Number of pages3
ISBN (Electronic)9781467377942
DOIs
Publication statusPublished - 2016 Jan 8
EventIEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Sendai, Japan
Duration: 2015 Aug 262015 Aug 28

Publication series

Name2015 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015 - Proceedings

Other

OtherIEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2015
CountryJapan
CitySendai
Period15/8/2615/8/28

Keywords

  • Chip-package-board interaction
  • Hardware-in-the-loop simulation
  • RF noise coupling

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Electrical and Electronic Engineering

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