Object-oriented CAE system for structural design of LSI packages

Kiyomi Kojima, Takeshi Terasaki, Hideo Miura, Asao Nishimura

Research output: Contribution to conferencePaper

Abstract

A practical structural design system for LSI packages has been developed based on object-oriented and graphic user interface technologies. An object-oriented technology is applied for creating product model-based analysis model (PBAM) which is independent of analytical method or tool. It is easy to create any CAE model from the PBAM. Graphical user interface is another effective technology for easy operation. Design engineers only have to select a model of interest and revise the dimensions or materials of the package, if necessary. As soon as they finish revising the input data, a CAE model such as finite element meshes are generated and the analysis starts automatically. The life of the solder joints, for example, is automatically evaluated and the results are displayed on a CRT. This system is very effective for designing new, highly reliable LSI packages in a short time.

Original languageEnglish
Publication statusPublished - 1999 Dec 1
Externally publishedYes
EventInterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999' - Maui, HI, USA
Duration: 1999 Jun 131999 Jun 19

Other

OtherInterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999'
CityMaui, HI, USA
Period99/6/1399/6/19

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering

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    Kojima, K., Terasaki, T., Miura, H., & Nishimura, A. (1999). Object-oriented CAE system for structural design of LSI packages. Paper presented at InterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999', Maui, HI, USA, .