Numerical analysis for small punch creep tests by finite-element method

Peng Cheng Zhai, Toshiyuki Hashida, Shin Ichi Komazaki, Qing Jie Zhang

Research output: Contribution to journalArticlepeer-review

2 Citations (Scopus)

Abstract

A numerical study is presented that simulates small punch creep (SP-C) tests using a finite-element method (FEM). The objective of the present study is to develop a miniaturized testing methodology for high-temperature creep properties. The numerical simulations have been shown to produce deflection versus time curves that are quantitatively similar to the experimental results obtained on tungsten-alloyed 9 % Cr ferritic steels. It is also demonstrated that the numerically predicted curves show the steady state (secondary) creep stage. Furthermore, the numerical simulations reveal that the magnitude of the equivalent stress in the central region of the SP-C specimen shows no significant change with respect to time at the secondary creep stage, supporting the use of the present SP-C testing method to characterize the secondary creep deformation rate. Finally, an approximate equation is proposed for the assessment of the equivalent stress in the SP-C specimen in terms of the load and testing parameters.

Original languageEnglish
Pages (from-to)298-303
Number of pages6
JournalJournal of Testing and Evaluation
Volume33
Issue number4
Publication statusPublished - 2005 Jul 1

Keywords

  • Creep properties
  • Equivalent stress
  • Finite-element analysis
  • Small punch creep testing

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Fingerprint Dive into the research topics of 'Numerical analysis for small punch creep tests by finite-element method'. Together they form a unique fingerprint.

Cite this