Numerical analysis for electromigration of Cu atom

Takenao Nemoto, Tutomu Murakawa, A. Toshimitsu Yokobori

    Research output: Contribution to journalArticlepeer-review

    1 Citation (Scopus)

    Abstract

    The electromigration of Cu interconnection was investigated to solve the Huntigton's equation by numerical analysis. The Cu atoms moved toward anode from cathode and accumulated at the anode end. This result was in good agreement with the result previously derived by our theoretical analysis. The accumulation rate of Cu atoms increased with increasing in current density, but it was not so influenced by temperature. The characteristic of the rate of electromigration showed a liner relationship with current density and exponential relationship with temperature. This result agreed with the equation experimentally derived by Black. This result proved that numerical analysis of atom transport equation enables to predict or electromigration failure time.

    Original languageEnglish
    Pages (from-to)2513-2517
    Number of pages5
    JournalMaterials Transactions
    Volume48
    Issue number9
    DOIs
    Publication statusPublished - 2007 Sep

    Keywords

    • Copper
    • Electromigration
    • Large scale integration (LSI)
    • Numerical analysis

    ASJC Scopus subject areas

    • Materials Science(all)
    • Condensed Matter Physics
    • Mechanics of Materials
    • Mechanical Engineering

    Fingerprint Dive into the research topics of 'Numerical analysis for electromigration of Cu atom'. Together they form a unique fingerprint.

    Cite this