Numerical analysis for electromigration of Cu atom

Takenao Nemoto; Tutomu Murakawa; Toshimitsu A. Yokobori

doi:10.2320/jinstmet.70.374

Numerical analysis for electromigration of Cu atom

Takenao Nemoto, Tutomu Murakawa, Toshimitsu A. Yokobori

Research output: Contribution to journal › Article › peer-review

2 Citations (Scopus)

Abstract

The electromigration of Cu interconnection was investigated to solve the Huntigton's equation by numerical analysis. The Cu atoms moved toward anode from cathode and accumulated at the anode end. This result was in good agreement with the result previously derived by our theoretical analysis. The accumulation rate of Cu atoms increased with increasing in current density, but it was not so influenced by temperature. The characteristic of the rate of electromigration showed a liner relationship with current density and exponential relationship with temperature. This result agreed with the equation experimentally derived by Black. This result proved that numerical analysis of Huntignton's equation enables to predict of electromigration failure time.

Original language	English
Pages (from-to)	374-379
Number of pages	6
Journal	Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Volume	70
Issue number	4
DOIs	https://doi.org/10.2320/jinstmet.70.374
Publication status	Published - 2006 Apr

Keywords

Copper
Electromigration
Numerical analysis

ASJC Scopus subject areas

Condensed Matter Physics
Mechanics of Materials
Metals and Alloys
Materials Chemistry

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title = "Numerical analysis for electromigration of Cu atom",

abstract = "The electromigration of Cu interconnection was investigated to solve the Huntigton's equation by numerical analysis. The Cu atoms moved toward anode from cathode and accumulated at the anode end. This result was in good agreement with the result previously derived by our theoretical analysis. The accumulation rate of Cu atoms increased with increasing in current density, but it was not so influenced by temperature. The characteristic of the rate of electromigration showed a liner relationship with current density and exponential relationship with temperature. This result agreed with the equation experimentally derived by Black. This result proved that numerical analysis of Huntignton's equation enables to predict of electromigration failure time.",

keywords = "Copper, Electromigration, Numerical analysis",

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T1 - Numerical analysis for electromigration of Cu atom

AU - Nemoto, Takenao

AU - Murakawa, Tutomu

AU - Yokobori, Toshimitsu A.

PY - 2006/4

Y1 - 2006/4

N2 - The electromigration of Cu interconnection was investigated to solve the Huntigton's equation by numerical analysis. The Cu atoms moved toward anode from cathode and accumulated at the anode end. This result was in good agreement with the result previously derived by our theoretical analysis. The accumulation rate of Cu atoms increased with increasing in current density, but it was not so influenced by temperature. The characteristic of the rate of electromigration showed a liner relationship with current density and exponential relationship with temperature. This result agreed with the equation experimentally derived by Black. This result proved that numerical analysis of Huntignton's equation enables to predict of electromigration failure time.

AB - The electromigration of Cu interconnection was investigated to solve the Huntigton's equation by numerical analysis. The Cu atoms moved toward anode from cathode and accumulated at the anode end. This result was in good agreement with the result previously derived by our theoretical analysis. The accumulation rate of Cu atoms increased with increasing in current density, but it was not so influenced by temperature. The characteristic of the rate of electromigration showed a liner relationship with current density and exponential relationship with temperature. This result agreed with the equation experimentally derived by Black. This result proved that numerical analysis of Huntignton's equation enables to predict of electromigration failure time.

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KW - Electromigration

KW - Numerical analysis

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