Numerical analysis for electromigration of Cu atom

Takenao Nemoto, Tutomu Murakawa, Toshimitsu A. Yokobori

    Research output: Contribution to journalArticlepeer-review

    4 Citations (Scopus)


    The electromigration of Cu interconnection was investigated to solve the Huntigton's equation by numerical analysis. The Cu atoms moved toward anode from cathode and accumulated at the anode end. This result was in good agreement with the result previously derived by our theoretical analysis. The accumulation rate of Cu atoms increased with increasing in current density, but it was not so influenced by temperature. The characteristic of the rate of electromigration showed a liner relationship with current density and exponential relationship with temperature. This result agreed with the equation experimentally derived by Black. This result proved that numerical analysis of Huntignton's equation enables to predict of electromigration failure time.

    Original languageEnglish
    Pages (from-to)374-379
    Number of pages6
    JournalNippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
    Issue number4
    Publication statusPublished - 2006 Apr


    • Copper
    • Electromigration
    • Numerical analysis

    ASJC Scopus subject areas

    • Condensed Matter Physics
    • Mechanics of Materials
    • Metals and Alloys
    • Materials Chemistry


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